White Electronic Designs
64Mx32 Flash Multi-Chip Package
3.0V Page Mode Flash Memory
FEATURES
Single power supply operation
• 3 volt read, erase, and program operations
I/O Control
• All input levels (address, control, and DQ input
levels) and outputs are determined by voltage on
V
IO
input. V
IO
range is 1.65 to V
CC
Secured Silicon Sector region
• 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
• May be programmed and locked at the factory or
by the customer
Flexible sector architecture
• Five hundred twelve 64 Kword (128 Kbyte) sectors
• Two hundred fifty-six 64 Kword (128 Kbyte)
sectors
• One hundred twenty-eight 64 Kword (128 Kbyte)
sectors
Compatibility with JEDEC standard
• Provides software compatibility for single-power
supply flash, and superior inadvertent write
protection
100,000 erase cycles per sector typical
20-year data retention typical
Software features
W764M32V-XSBX
• Program Suspend and Resume: read other
sectors before programming operation is
completed
• Erase Suspend and Resume: read/program other
sectors before an erase operation is completed
• Data# polling and toggle bits provide status
• Unlock Bypass Program command reduces overall
multiple-word programming time
• CFI (Common Flash Interface) compliant: allows
host system to identify and accommodate multiple
flash devices
Hardware features
• Advanced Sector Protection
• WP#/ACC input accelerates programming
time (when high voltage is applied) for greater
throughput during system production. Protects
first or last sector regardless of sector protection
settings
• Hardware reset input (RESET#) resets device
• Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
* This product is subject to change without notice.
PERFORMANCE CHARACTERISTICS
High Performance
• 100, 120 ns
• 8-word/16-byte page read buffer
• 25 ns page read times
• 16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
Package option
• 107 BGA, 14mm x 17mm
• 1.0mm pitch
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2009
Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
GENERAL DESCRIPTION
The W764MB2V-XSBX device is a 3.0V single power flash
memory. The device utilizes four organized as 33,554,432
words or 67, 108,864 bytes. The device has a 32-bit wide
data bus, can be programmed either in the host system or
in standard EPROM programmers.
Each device requires a single 3.0 volt power supply for both
read and write functions. In addition to a V
CC
input, a high-
voltage accelerated program (WP# / ACC) input provides
shorter programming times through increased current. This
feature is intended to facilitate factory throughput during
system production, but may also be used in the field if
desired.
The devices are entirely command set compatible with the
JEDEC single power-supply Flash standard. Commands
are written to the device using standard microprocessor write
timing. Write cycles also internally latch addresses and data
needed for the programming and erase operations.
The sector erase architecture allows memory sectors to
be erased and reprogrammed without affecting the data
contents of other sectors. The device is fully erased when
shipped from the factory.
Device programming and erasure are initiated through
command sequences. Once a program or erase operation
has begun, the host system need only poll the DQ7 (Data#
Polling) or DQ6 (toggle) status bits or monitor the Ready /
Busy# (RY / BY#) output to determine whether the operation
is complete. To facilitate programming, an Unlock Bypass
mode reduces command sequence over head by requiring
only two write cycles to program data instead of four.
The I/O (V
IO
) control allows the host system to set the
voltage levels that the device generates and tolerates on
all input levels (address, chip control, and DQ input levels)
to the same voltage level that is asserted on the V
IO
pin.
This allows the device to operate in a 1.8 V or 3 V system
environment as required.
Hardware data protection measures include a low V
CC
detector that automatically inhibits write operations during
power transitions. Persistent Sector Protection provides
in-system, comand-enabled protection of any combination
of sectors using a single power supply at V
CC
. Password
Sector Protection prevents unauthorized write and erase
operations in any combination of sectors through a user-
defined 64-bit password.
W764M32V-XSBX
The erase Suspend / Erase Resume feature allows the host
system to pause and erase operation in a given sector to
read or program any other sector and then complete the
erase operation. The Program Suspend / Program Resume
feature enables the host system to pause the program
operation in a given sector to read any other sector and
then complete the program operation.
The hardware RESET# pin terminates any operation in
progress and resets the device, after which it is then ready
for a new operation. The RESET# pin may be tied to the
system reset circuitry. A system reset would thus also
reset the device, enabling the host system to read boot-up
firmware from the Flash memory device.
The device reduces power consumption in the standby
mode when it detects specific voltage levels on CS# and
RESET#, or when addresses have been stable for a
specified period of time.
The Secured Silicon Sector provides a 128-work/256-byte
area for code or data that can be permanently protected.
Once this sector is protected, no further changes within the
sector can occur.
The Write Protect (WP# / ACC) feature protects the first or
last sector by asserting a logic low on the WP# pin.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2009
Rev. 6
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
FIG 1: PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
W764M32V-XSBX
PIN DESCRIPTION
DQ
0-31
A
0-24, A-1*
WE#
0-1
CS#
0-1
OE#
RESET#
WP#/ACC
RY/BY#
V
CC
V
IO
GND
DNU
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Hardware Reset
Hardware Write
Protection/Acceleration
Ready/Busy Output
Power Supply
I/O Power Supply
Ground
Do Not Use
A
B
C
D
E
F
G
H
J
K
L
M
VI0
VCC
DQ24
DQ8
GND
A0
A3
VCC
GND
DQ10
DQ25
DQ9
GND
A1
A4
A6
VIO
DQ12
DQ27
DQ11
DQ26
GND
OE#
A5
RY/BY#
A7
DQ13
DQ29
DQ28
DNU
GND
A2
RESET#
WP/ACC#
A14
DQ14
DQ30
DQ31
VIO
GND
VIO
CS0#
WE1#
A15
DQ15
GND
VIO
VCC
GND
VCC
VIO
GND
A22
DQ0
GND
VIO
VCC
GND
VCC
VIO
GND
A23
DQ1
DQ17
DQ16
VIO
GND
VIO
CS1#
WE0#
A17
* A-1 is the least significant address.
DQ18
DQ2
DQ3
DNU
GND
A19
A20
A21
A18
DQ19
DQ4
DQ20
DQ21
GND
A-1
A10
A9
A8
VIO
DQ5
DQ6
DQ23
GND
A16
A12
A11
VIO
BLOCK DIAGRAM
GND
VCC
DQ22
DQ7
GND
A24
A13
VCC
GND
WE0#
CS0#
RY/BY#
RESET#
OE#
A-1,A
0-24
WE1#
CS1#
64M X 8
64M X 8
64M X 8
64M X 8
WP#/ACC
DQ
0-7
DQ
8-15
DQ
16-23
DQ
24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2009
Rev. 6
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Supply Voltage Range (V
CC
)
Signal Voltage Range
Storage Temperature Range
-55 to +125
-0.5 to +4.0
-0.5 to Vcc +0.5
-55 to +125
Unit
°C
V
V
°C
W764M32V-XSBX
CAPACITANCE
T
A
= +25°C, F = 1.0MHz
Parameter
WE#0-1 capacitance
CS#0-1 capacitance
Data I/O capacitance
Address input capacitance
RESET# capacitance
WP#/ACC capacitance
OE# capacitance
Symbol
C
WE
C
CS
C
I/O
C
AD
C
RS
C
RB
C
OE
Max
14
20
10
28
80
116
23
Unit
pF
pF
pF
pF
pF
pF
pF
NOTES:
1. Minimum DC voltage on input or input or I/Os is -0.5V. During voltage transitions,
inputs or I/Os may overshoot V
SS
to -2.0V for periods of up to 20ns. Maximum DC
voltage on input or I/Os us VCC + 0.5V. During voltage transitions, input or I/O pins
may overshoot to V
CC
+ 2.0V for periods up to 20ns
2. Minimum DC input voltage on pins A9, OE#, and ACC is 0.5V. During voltage
transitions, A9, OE#, and ACC may overshoot V
SS
to -2.0V for periods of up to 20ns.
Maximum DC input voltage on pin A9, OE#, and ACC is +12.5V which may overshoot
to +14.0V for periods up to 20ns
3. No more than one output may be shorted to ground at a time. Duration of the short
circuit should not be greater than one second.
4. Stresses above those listed under Absolute Maxium Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those indicated in the operational sections
of the data sheet is not implied. Exposure of the device to absolute maxium rating
conditons for extended peroids may affect device reliability
This parameter is guaranteed by design but not tested.
DATA RETENTION
Parameter
Pattern Data
Retention Time
Test Conditions
150°C
125°C
Min
10
20
Unit
Years
Years
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
Symbol
V
CC
T
A
T
A
Min
3.0
-55
-40
Max
3.6
+125
+85
Unit
V
°C
°C
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2009
Rev. 6
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
DC CHARACTERISTICS – CMOS COMPATIBLE
V
CC
= 3.3V ± 0.3V, -55°C
≤
T
A
≤
+125°C
Parameter
Input Load Current (1)
A9 Input Load Current
Output Leakage Current
Symbol
I
LI
I
LIT
I
LO
Conditions
V
IN
= V
SS
to V
CC
, #V
CC =
V
CC(MAX)
V
CC
= to V
CC(MAX)
; A9 = 12.5V
V
OUT
= V
SS
to V
CC
, # V
CC
=
V
CC(MAX)
CE# = V
IL
#, OE# = V
IH
, V
CC
=
V
CC(MAX)
; # f = 1 MHz, Byte Mode
CE# = V
IL
#, OE# = V
IH
, V
CC
=
V
CC(MAX)
; # f = 5MHz, Word Mode
CE# = V
IL
#, OE# = V
IH
, V
CC
=
V
CC(MAX)
; f = 10MHz
CE# = V
IL
#, OE# = V
IH
, V
CC
=
V
CC(MAX)
V
CC
= V
CC(MAX);
V
IO
= V
CC
; OE# =
V
IH
; # V
IL
= V
SS
+ 0.3V/-0.1V; #
CE#, RESET# = V
SS
± 0.3V
V
CC
= V
CC(MAX);
V
IO
= V
SS
+ 0.3V/-
0.1V; RESET# = V
SS
± 0.3V
V
CC
= V
CC(MAX);
V
IO
= V
CC
; V
IH =
V
CC
± 0.3V; #V
IL
= V
SS +
0.3V/-
0.1V; WP#/A
CC
= V
IH
CE# = V
IL
, OE# = V
IH
, V
CC
=
V
CC(MAX)
, #WP#/A
CC
= V
IH
WP#/A
CC
pin
V
CC
pin
-0.1
0.7 x V
IO
V
CC
= 2.7 - 3.6V
V
CC
= 2.7 - 3.6V
I
OL
= -100
μA
I
OH
= -100
μA
11.5
11.5
0.85 x V
IO
2.3
Min
W764M32V-XSBX
Typ
Max
WP/ACC: ±2.0
Others: ±1.0
35
±1.0
Unit
μA
μA
μA
mA
mA
mA
mA
μA
μA
μA
mA
V
V
V
V
V
V
V
24
120
1
200
4
4
4
40
200
80
200
10
320
20
20
20
80
320
0.3 x V
IO
V
IO
+ 0.3
12.5
12.5
0.15 x V
IO
2.5
V
CC
Active Current for Read (1)
I
CC1
V
CC
Intra-Page Read Current (1)
V
CC
Active Erase/Program Current (2,3)
V
CC
Standby Current
V
CC
Reset Current
Automatic Sleep Mode (4)
A
CC
Accelerated Program Current
Input Low Voltage (5)
Input High Voltage (5)
Voltage for ACC Erase/Program
Acceleration
Voltage for Autoselect and Temporary
Sector Unprotect
Output Low Voltage (5)
Output High Voltage (5)
Low V
CC
Lock-Out Voltage
I
CC2
I
CC3
I
CC4
I
CC5
I
CC6
I
ACC
V
IL
V
IH
V
HH
V
ID
V
OL
V
OH
V
LKO
NOTES:
1. The I
CC
current is typically less than 2 mA/MHz, with OE# at V
IH
2. I
CC
active while Embedded Erase or Embedded Program or Write Buffer Programming is in progress.
3. Not 100% tested.
4. Automatic sleep mode enables the lower power mode when addresses remain stable for t
ACC
+ 30ns.
5. V
IO
= 1.65-1.95V or 2.7-3.6V.
6. V
CC
= 3 V and V
IO
= 3V or 1.8V. When V
IO
is at 1.8V, I/O pins cannot operate at 3V.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
June 2009
Rev. 6
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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