LMC6462BIN/NOPB datasheet, PDF

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LMC6462BIN/NOPB: DescriptionIC DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size61KB，12 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com; Environmental Compliance

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LMC6462BIN/NOPB Overview

IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier

LMC6462BIN/NOPB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00001 µA
Minimum Common Mode Rejection Ratio	62 dB
Nominal Common Mode Rejection Ratio	74 dB
frequency compensation	YES
Maximum input offset voltage	3000 µV
JESD-30 code	R-PDIP-T8
JESD-609 code	e3
length	9.817 mm
low-bias	YES
low-dissonance	NO
micropower	YES
Humidity sensitivity level	1
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	2
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
method of packing	RAIL
Peak Reflow Temperature (Celsius)	260
power supply	3/15 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
minimum slew rate	0.008 V/us
Nominal slew rate	0.023 V/us
Maximum slew rate	0.07 mA
Supply voltage upper limit	16 V
Nominal supply voltage (Vsup)	3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
Nominal Uniform Gain Bandwidth	50 kHz
width	7.62 mm
Base Number Matches	1

LMC6462BIN/NOPB Related Products

	LMC6462BIN/NOPB	LMC6462AIM/NOPB	LMC6462BIM/NOPB	LMC6462BIMX/NOPB	LMC6462AIN/NOPB	LMC6462AIMX/NOPB
Description	IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier	IC DUAL OP-AMP, 2000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier	IC DUAL OP-AMP, 2000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDIP8, ROHS COMPLIANT, DIP-8, Operational Amplifier	IC DUAL OP-AMP, 2000 uV OFFSET-MAX, 0.05 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIP	SOIC	SOIC	SOIC	DIP	SOIC
package instruction	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	SOP, SOP8,.25
Contacts	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.00001 µA	0.00001 µA	0.00001 µA	0.00001 µA	0.00001 µA	0.00001 µA
Minimum Common Mode Rejection Ratio	62 dB	67 dB	62 dB	62 dB	67 dB	67 dB
Nominal Common Mode Rejection Ratio	74 dB	74 dB	74 dB	74 dB	74 dB	74 dB
frequency compensation	YES	YES	YES	YES	YES	YES
Maximum input offset voltage	3000 µV	2000 µV	3000 µV	3000 µV	2000 µV	2000 µV
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8
JESD-609 code	e3	e3	e3	e3	e3	e3
length	9.817 mm	4.9 mm	4.9 mm	4.9 mm	9.817 mm	4.9 mm
low-bias	YES	YES	YES	YES	YES	YES
low-dissonance	NO	NO	NO	NO	NO	NO
micropower	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	1	1	1	1	1	1
Number of functions	2	2	2	2	2	2
Number of terminals	8	8	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP	SOP	DIP	SOP
Encapsulate equivalent code	DIP8,.3	SOP8,.25	SOP8,.25	SOP8,.25	DIP8,.3	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
method of packing	RAIL	RAIL	RAIL	TAPE AND REEL	RAIL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	3/15 V	3/15 V	3/15 V	3/15 V	3/15 V	3/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	1.75 mm	1.75 mm	1.75 mm	5.08 mm	1.75 mm
minimum slew rate	0.008 V/us	0.008 V/us	0.008 V/us	0.008 V/us	0.008 V/us	0.008 V/us
Nominal slew rate	0.023 V/us	0.023 V/us	0.023 V/us	0.023 V/us	0.023 V/us	0.023 V/us
Maximum slew rate	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Supply voltage upper limit	16 V	16 V	16 V	16 V	16 V	16 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	NO	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	40	40	40	40
Nominal Uniform Gain Bandwidth	50 kHz	50 kHz	50 kHz	50 kHz	50 kHz	50 kHz
width	7.62 mm	3.9 mm	3.9 mm	3.9 mm	7.62 mm	3.9 mm
Base Number Matches	1	1	1	1	1	1

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