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TESVFD1A336M12R

Description
CAPACITOR, TANTALUM, SOLID, POLARIZED, 10V, 33uF, SURFACE MOUNT, 2917, CHIP
CategoryPassive components    capacitor   
File Size57KB,3 Pages
ManufacturerNEC TOKIN ( KEMET Corporation )
Websitehttp://www.kemet.com
Download Datasheet Parametric View All

TESVFD1A336M12R Overview

CAPACITOR, TANTALUM, SOLID, POLARIZED, 10V, 33uF, SURFACE MOUNT, 2917, CHIP

TESVFD1A336M12R Parametric

Parameter NameAttribute value
package instruction, 2917
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance33 µF
Capacitor typeTANTALUM CAPACITOR
dielectric materialsTANTALUM (DRY/SOLID)
Manufacturer's serial numberSV/F
Installation featuresSURFACE MOUNT
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, PLASTIC, 7 INCH
polarityPOLARIZED
positive tolerance20%
Rated (DC) voltage (URdc)10 V
size code2917
surface mountYES
Delta tangent0.06
Terminal shapeWRAPAROUND
Base Number Matches1
SV/F Series Tantalum Chip Capacitors
(Fuse Built-in Type)
DIMENSIONS [mm]
[B2 cases]
.
F
1
35R
L
H
PERFORMANCE CHARACTERISTICS
[C, D cases]
4.7
16R
[D2 cases]
.
F
W
1
H
Operating temperature range
−55
to +125°C with proper voltage
derating as shown in the following table.
DC working voltage and surge voltage
Rated voltage
Working
at 85°C
10
10
16
16
10
20
20 25
20 25
13 16
26 33
35
35
22
46
50
50
32
65
V
V
V
V
15
10R
Y
.F
W
1
L
Z
Z
W
2
Z
Z
W
2
Surge
(Unit: mm)
at 125°C 6.3
at 85°C
13
Case
EIA code
Code
B2
C
D2
D
3528
6032
5846
7343
L
3.5
±
0.2
6.0
±
0.2
5.8
±
0.2
7.3
±
0.2
W
1
2.8
±
0.2
3.2
±
0.2
4.6
±
0.2
4.3
±
0.2
W
2
2.3
±
0.1
2.2
±
0.1
2.4
±
0.1
2.4
±
0.1
H
1.9
±
0.2
2.5
±
0.2
3.2
±
0.2
2.8
±
0.2
Z
0.8
±
0.2
1.3
±
0.2
1.3
±
0.2
1.3
±
0.2
Y
0.4 C
0.5 C
Capacitance (at 20°C, 120 Hz)
Range:
1
µ
F to 47
µ
F
Tolerance:
±
20%,
±10%
Capacitance change with temperature
Not to exceed
−12%
at
−55°C,
+12% at
85°C, and +15% at 125°C
Tangent of loss angle (at 20°C, 120 Hz)
1
µ
F to 4.7
µ
F: less than 0.04
6.8
µ
F to 47
µ
F: less than 0.06
µ
F
1
DC Rated
Voltage
(Vdc)
10
16
20
25
35
B2
50
C
DC leakage current (at 20°C)
0.01 C
V
Note
µ
A or 0.5
µ
A, whichever is greater
Damp heat (90 to 95% RH at 40°C, 56 days (1344 h))
Capacitance change:
±5%
Tangent of loss angle: 150% of
initial requirements
DC leakage current:
initial requirements
Endurance (at 85°C, DC rated voltage, 2000 h)
Capacitance change:
±10%
Tangent of loss angle: initial requirements
DC leakage current:
125% of
initial requirements
Resistance to soldering heat
(solder reflow at 260°C, 10 s.
or solder dip at 260°C, 5 s.)
Capacitance change:
±5%
Leakage current:
initial requirements
Tangent of loss angle: initial requirements
Fuse blow-out characteristic
Blow-out time:
B2 case:
5 s Max. with 2 A applied
C case:
10 s Max. with 2 A applied
D2, D cases: 20 s Max. with 2 A applied
Note:
Product of capacitance in
µ
F and voltage in V.
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
D2, D
D
C, D2
B2
B2
C
C
C
D2, D
D2, D
D
D2, D
D
D
C
B2
B2
C
C
D2, D
D2, D
D
D
D2
See pages 25 and 26 for taping specifications.
20

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