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V916764B24QBFW-D3

Description
DDR DRAM Module, 64MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200
Categorystorage    storage   
File Size117KB,16 Pages
ManufacturerProMOS Technologies Inc
Environmental Compliance  
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V916764B24QBFW-D3 Overview

DDR DRAM Module, 64MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200

V916764B24QBFW-D3 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSODIMM
package instructionDIMM,
Contacts200
Reach Compliance Codecompliant
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time0.6 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XZMA-N200
JESD-609 codee4
memory density4294967296 bit
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals200
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
organize64MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountNO
technologyCMOS
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
V916764B24QB
64M x 64 HIGH PERFORMANCE
UNBUFFERED DDR2 SDRAM SODIMM
Features
200-pin, unbuffered small outline, dual in-line
memory module (SODIMM)
JEDEC standard 1.8V + 0.1V power supply
VDDQ=1.8V + 0.1V
Fast data transfer rate: PC2-3200, PC2-4200,
PC2-5300, or PC6400
Programmable CAS Latency (CL): 3, 4, 5
Programmable Additive Latency (AL): 0, 1, 2, 3
and 4
Write Latency(WL) = Read Latency (RL)-1
Programmble burst lengths: 4 or 8
Differential data strobe (DQS, DQS#)
(Single ended data strobe option)
On-die termination (ODT)
Adjustable data-output drive strength
64ms, 8192-cycle refresh
Serial Presence Detect (SPD) with EEPROM
Description
The V916764B24QB memory module is orga-
nized as 67,108,864 x 64 bits in a 200 pin memory
module. The 64M x 64 memory module uses 8 Pro-
MOS 32M x 16 DDR2 SDRAMs. The x64 modules
are ideal for use in high performance computer sys-
tems where increased memory density and fast
access times are required.
Speed Grade
DDR2-400
PC2-3200
(D3)
Bandwith@CL=3
Bandwith@CL=4
Bandwith@CL=5
CL-tRCD-tRP
400
400
400
3-3-3
DDR2-533
PC2-4200
(E4)
400
533
533
4-4-4
DDR2-667
PC2-5300
(F5)
400
533
667
5-5-5
DDR2-800
PC2-6400
(G5)
400
533
800
5-5-5
Units
Mbps
Mbps
Mbps
tCK
V916764B24QB Rev 1.1 March 2007
1

V916764B24QBFW-D3 Related Products

V916764B24QBFW-D3 V916764B24QBFW-G5 V916764B24QBFW-F5 V916764B24QBFW-E4
Description DDR DRAM Module, 64MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 DDR DRAM Module, 64MX64, 0.45ns, CMOS, ROHS COMPLIANT, SODIMM-200 DDR DRAM Module, 64MX64, 0.45ns, CMOS, ROHS COMPLIANT, SODIMM-200 DDR DRAM Module, 64MX64, 0.5ns, CMOS, ROHS COMPLIANT, SODIMM-200
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code SODIMM SODIMM SODIMM SODIMM
package instruction DIMM, DIMM, DIMM, DIMM,
Contacts 200 200 200 200
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 0.6 ns 0.45 ns 0.45 ns 0.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-XZMA-N200 R-XZMA-N200 R-XZMA-N200 R-XZMA-N200
JESD-609 code e4 e4 e4 e4
memory density 4294967296 bit 4294967296 bit 4294967296 bit 4294967296 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 64 64 64 64
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 200 200 200 200
word count 67108864 words 67108864 words 67108864 words 67108864 words
character code 64000000 64000000 64000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
organize 64MX64 64MX64 64MX64 64MX64
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Terminal surface Gold (Au) Gold (Au) Gold (Au) Gold (Au)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location ZIG-ZAG ZIG-ZAG ZIG-ZAG ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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