3803 Group (Spec.L)
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
REJ03B0212-0101
Rev.1.01
Jan 25, 2008
• Power source voltage (Flash memory version)
[In high-speed mode]
At 16.8 MHz oscillation frequency .................... 4.5 to 5.5 V
At 12.5 MHz oscillation frequency .................... 4.0 to 5.5 V
At 8.4 MHz oscillation frequency ...................... 2.7 to 5.5 V
[In middle-speed mode]
At 16.8 MHz oscillation frequency .................... 4.5 to 5.5 V
At 12.5 MHz oscillation frequency .................... 2.7 to 5.5 V
[In low-speed mode]
At 32 kHz oscillation frequency......................... 2.7 to 5.5 V
• Power dissipation (Mask ROM version)
In high-speed mode ........................................... 40 mW (typ.)
(at 16.8 MHz oscillation frequency, at 5 V power source voltage)
In low-speed mode ............................................ 45
µW
(typ.)
(at 32 kHz oscillation frequency, at 3 V power source voltage)
• Power dissipation (Flash memory version)
In high-speed mode ........................................ 27.5 mW (typ.)
(at 16.8 MHz oscillation frequency, at 5 V power source voltage)
In low-speed mode ........................................ 1200
µW
(typ.)
(at 32 kHz oscillation frequency, at 3 V power source voltage)
• Operating temperature range .............................
−20
to 85
°C
• Packages
SP...............PRDP0064BA-A (64P4B) (64-pin 750 mil SDIP)
HP ......PLQP0064KB-A (64P6Q-A) (64-pin 10 × 10 mm LQFP)
KP ......PLQP0064GA-A (64P6U-A) (64-pin 14 × 14 mm LQFP)
WG ........PTLG0064JA-A (64F0G) (64-pin 6 × 6 mm FLGA)
<Flash memory mode>
• Power source voltage ................................ V
CC
= 2.7 to 5.5 V
• Program/Erase voltage ............................. V
CC
= 2.7 to 5.5 V
• Programming method ............... Programming in unit of byte
• Erasing method ................................................. Block erasing
• Program/Erase control by software command
• Number of times for programming/erasing ...................... 100
<Notes>
The flash memory version cannot be used for application
embedded in the MCU card.
DESCRIPTION
The 3803 group (Spec.L) is the 8-bit microcomputer based on the
740 family core technology.
The 3803 group (Spec.L) is designed for household products,
office automation equipment, and controlling systems that
require analog signal processing, including the A/D converter
and D/A converters.
FEATURES
• Basic machine-language instructions ................................. 71
• Minimum instruction execution time .......................... 0.24
µs
(at 16.8 MHz oscillation frequency)
• Memory size
Mask ROM/Flash memory .................................... 60 K bytes
RAM ...................................................................... 2048 bytes
• Programmable input/output ports ....................................... 56
• Software pull-up resistors ............................................ Built-in
• Interrupts
21 sources, 16 vectors...............................................................
(external 8, internal 12, software 1)
• Timers ...................................................................... 16-bit × 1
8-bit × 4
(with 8-bit prescaler)
• Serial interface ......... 8-bit × 2 (UART or Clock-synchronized)
8-bit × 1 (Clock-synchronized)
• PWM ....................................... 8-bit × 1 (with 8-bit prescaler)
• A/D converter ........................................ 10-bit × 16 channels
(8-bit reading enabled)
• D/A converter ............................................ 8-bit × 2 channels
• Watchdog timer ....................................................... 16-bit × 1
• LED direct drive port..............................................................8
• Clock generating circuit ............................. Built-in 2 circuits
(connect to external ceramic resonator or quartz-crystal oscillator)
• Power source voltage (Mask ROM version)
[In high-speed mode]
At 16.8 MHz oscillation frequency ....................4.5 to 5.5 V
At 12.5 MHz oscillation frequency ....................4.0 to 5.5 V
At 8.4 MHz oscillation frequency ......................2.7 to 5.5 V
At 4.2 MHz oscillation frequency ......................2.2 to 5.5 V
At 2.1 MHz oscillation frequency ......................2.0 to 5.5 V
[In middle-speed mode]
At 16.8 MHz oscillation frequency ....................4.5 to 5.5 V
At 12.5 MHz oscillation frequency ....................2.7 to 5.5 V
At 8.4 MHz oscillation frequency ......................2.2 to 5.5 V
At 6.3 MHz oscillation frequency ......................1.8 to 5.5 V
[In low-speed mode]
At 32 kHz oscillation frequency.........................1.8 to 5.5 V
Rev.1.01 Jan 25, 2008
REJ03B0212-0101
Page 1 of 117
3803 Group (Spec.L)
Table 1
Performance overview
Parameter
Function
71
0.24
µs
(Oscillation frequency 16.8 MHz)
Oscillation frequency 16.8 MHz(Maximum)
ROM
RAM
Flash memory version
ROM
RAM
60 Kbytes
2048 bytes
60 Kbytes
2048 bytes
56 pins
Built-in
21 sources, 16 vectors (8 external, 12 internal, 1 software)
8-bit
×
4 (with 8-bit prescaler), 16-bit
×
1
8-bit
×
2 (UART or Clock-synchronized)
8-bit
×
1 (Clock-synchronized)
8-bit
×
1 (with 8-bit prescaler)
10-bit
×
16 channels (8-bit reading enabled)
8-bit
×
2 channels
16-bit
×
1
8 (average current: 15 mA, peak current: 30 mA, total current: 90 mA)
Built-in 2 circuits
(connect to external ceramic rasonator or quartz-crystal oscillator)
At 16.8 MHz
At 12.5 MHz
At 8.4 MHz
At 4.2 MHz
At 2.1 MHz
In middle-
speed mode
At 16.8 MHz
At 12.5 MHz
At 8.4 MHz
At 6.3 MHz
In low-speed
mode
At 32 MHz
Mask ROM version
Flash memory version
Mask ROM version
Flash memory version
Mask ROM version
Flash memory version
Mask ROM version
Mask ROM version
Mask ROM version
Flash memory version
Mask ROM version
Flash memory version
Mask ROM version
Mask ROM version
Mask ROM version
Mask ROM version
Mask ROM version
4.5 to 5.5 V
4.0 to 5.5 V
2.7 to 5.5 V
2.2 to 5.5 V
2.0 to 5.5 V
4.5 to 5.5 V
2.7 to 5.5 V
2.2 to 5.5 V
1.8 to 5.5 V
1.8 to 5.5 V
40 mW
45
µW
V
CC
10 mA
-20 to 85
°C
CMOS sillicon gate
64-pin plastic molded SDIP/LQFP/FLGA
Number of basic instructions
Minimum instruction execution time
Oscillation frequency
Memory
sizes
Mask ROM version
I/O port
Interrupt
Timer
P0-P6
Software pull-up resistors
Serial interface
PWM
A/D converter
D/A converter
Watchdog timer
LED direct drive port
Clock generating circuits
Power
source
voltage
In high-speed
mode
Flash memory version 2.7 to 5.5 V
Flash memory version 27.5 mW
Power
dissipation
In high-speed mode
In low-speed mode
Flash memory version 1200
µW
Input/Output Input/Output withstand voltage
characteris- Output current
tics
Operating temperature range
Device structure
Package
Rev.1.01 Jan 25, 2008
REJ03B0212-0101
Page 4 of 117
Embedded System
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