EEWORLDEEWORLDEEWORLD

Part Number

Search

79C2040RPFK-20

Description
EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100
Categorystorage    storage   
File Size471KB,17 Pages
ManufacturerMaxwell Technologies Inc.
Download Datasheet Parametric Compare View All

79C2040RPFK-20 Overview

EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100

79C2040RPFK-20 Parametric

Parameter NameAttribute value
Parts packaging codeDFP
package instructionDFP, FL100,.9,25
Contacts100
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time200 ns
Data pollingYES
JESD-30 codeR-PDFP-F100
length34.6964 mm
memory density20971520 bit
Memory IC TypeEEPROM
memory width40
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX40
Package body materialPLASTIC/EPOXY
encapsulated codeDFP
Encapsulate equivalent codeFL100,.9,25
Package shapeRECTANGULAR
Package formFLATPACK
page size128 words
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height12.7 mm
Maximum standby current0.00064 A
Maximum slew rate0.25 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch0.635 mm
Terminal locationDUAL
switch bitNO
total dose100k Rad(Si) V
width22.7838 mm
Maximum write cycle time (tWC)10 ms
write protectHARDWARE/SOFTWARE
Base Number Matches1
79C2040
20 Megabit (512K x 40-Bit)
EEPROM MCM
Logic Diagram
Memory
F
EATURES
:
512k x 40-bit EEPROM MCM
• R
AD
-P
AK
® radiation-hardened against natural
• space radiation
• Total dose hardness:
- >100 krad (Si)
- Dependent upon orbit
• Excellent Single event effects
- SEL
TH
> 120 MeV/mg/cm
2
- SEU > 90 MeV/mg/cm
2
read mode
- SEU = 18 MeV/mg/cm
2
write mode
• High endurance
- 10,000 cycles/byte (Page Programming Mode)
- 10 year data retention
• Page Write Mode: 128 Dword Page
• High Speed:
- 150 and 200 ns maximum access times
• Automatic programming
- 10 ms automatic Page/Dword write
• Low power dissipation
- 375 mW/MHz active current
-3. 2 mW standby current
D
ESCRIPTION
:
Maxwell Technologies’ 79C2040 multi-chip module (MCM)
memory features a greater than 100 krad (Si) total dose toler-
ance, dependent upon orbit. Using Maxwell Technologies’ pat-
ented radiation-hardened R
AD
-P
AK
® MCM packaging
technology, the 79C2040 is the first radiation-hardened 20
megabit MCM EEPROM for space application. The 79C2040
uses twenty 1 Megabit high speed CMOS die to yield a 20
megabit product. The 79C2040 is capable of in-system electri-
cal byte and page programmability. It has a 128 word page
programming function to make the erase and write operations
faster. It also features Data Polling and a Ready/Busy signal to
indicate the completion of erase and programming operations.
In the 79C2040, hardware data protection is provided with the
RES pin, in addition to noise protection on the WE signal and
write inhibit on power on and off. Software data protection is
implemented using the JEDEC optional standard algorithm.
Maxwell Technologies' patented R
AD
-P
AK
® packaging technol-
ogy incorporates radiation shielding in the microcircuit pack-
age. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, R
AD
-P
AK
provides greater than 100
krad (Si) radiation dose tolerance. This product is available
with screening up to Maxwell Technologies self-defined Class
K
09.07.05 Rev 2
All data sheets are subject to change without notice
1
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com
©2005 Maxwell Technologies
All rights reserved.

79C2040RPFK-20 Related Products

79C2040RPFK-20 79C2040RPFE-15 79C2040RPFE-20 79C2040RPFH-15 79C2040RPFH-20 79C2040RPFI-15 79C2040RPFI-20 79C2040RPFK-15
Description EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 150ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 150ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 150ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 200ns, Parallel, CMOS, PDFP100, FP-100 EEPROM, 512KX40, 150ns, Parallel, CMOS, PDFP100, FP-100
Parts packaging code DFP DFP DFP DFP DFP DFP DFP DFP
package instruction DFP, FL100,.9,25 DFP, DFP, DFP, FL100,.9,25 DFP, FL100,.9,25 DFP, FL100,.9,25 DFP, FL100,.9,25 DFP, FL100,.9,25
Contacts 100 100 100 100 100 100 100 100
Reach Compliance Code compliant unknown unknown compliant compliant compliant compliant compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 200 ns 150 ns 200 ns 150 ns 200 ns 150 ns 200 ns 150 ns
JESD-30 code R-PDFP-F100 R-PDFP-F100 R-PDFP-F100 R-PDFP-F100 R-PDFP-F100 R-PDFP-F100 R-PDFP-F100 R-PDFP-F100
length 34.6964 mm 34.6964 mm 34.6964 mm 34.6964 mm 34.6964 mm 34.6964 mm 34.6964 mm 34.6964 mm
memory density 20971520 bit 20971520 bit 20971520 bit 20971520 bit 20971520 bit 20971520 bit 20971520 bit 20971520 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 40 40 40 40 40 40 40 40
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 512KX40 512KX40 512KX40 512KX40 512KX40 512KX40 512KX40 512KX40
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DFP DFP DFP DFP DFP DFP DFP DFP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 12.7 mm 12.7 mm 12.7 mm 12.7 mm 12.7 mm 12.7 mm 12.7 mm 12.7 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT
Terminal pitch 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
total dose 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V
width 22.7838 mm 22.7838 mm 22.7838 mm 22.7838 mm 22.7838 mm 22.7838 mm 22.7838 mm 22.7838 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
Base Number Matches 1 1 1 1 1 1 1 1
Data polling YES - - YES YES YES YES YES
Encapsulate equivalent code FL100,.9,25 - - FL100,.9,25 FL100,.9,25 FL100,.9,25 FL100,.9,25 FL100,.9,25
page size 128 words - - 128 words 128 words 128 words 128 words 128 words
power supply 5 V - - 5 V 5 V 5 V 5 V 5 V
ready/busy YES - - YES YES YES YES YES
Maximum standby current 0.00064 A - - 0.00064 A 0.00064 A 0.00064 A 0.00064 A 0.00064 A
Maximum slew rate 0.25 mA - - 0.25 mA 0.25 mA 0.25 mA 0.25 mA 0.25 mA
switch bit NO - - NO NO NO NO NO
write protect HARDWARE/SOFTWARE - - HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Problems with WinCE application calling USB driver to send data
I debugged a USB function driver using the 6410 development board of UFIDA, and wanted to use this driver to send data to the host through the USB interface. I wrote a simple application program to se...
lkl Embedded System
Handwriting drawing tablet
Which senior can share the program for the handwriting drawing board question from 2013 with me? I am practicing this question recently and have no idea how to determine the coordinates and track the ...
AlizaJoyous Electronics Design Contest
msp430f5430, using XT2, frequency 16MHz, system clock initialization reference program
#include "msp430x54x.h"void main(void){WDTCTL = WDTPW + WDTHOLD;// Stop watchdog timerP5SEL |= 0x0C;// Port select XT2UCSCTL6 = ~XT2OFF;// Enable XT2UCSCTL3 |= SELREF_2;// FLLref = REFO// Since LFXT1 ...
MrWang_ Microcontroller MCU
Ask everyone a question, please help
I am using C# 2005 to develop a WINCE program. Why is the focus on the button and pressing the Enter key not triggering the CLICK event? If it is triggered by a message, how should SendMessage or Post...
fantery Embedded System
STM32 output 4-20MA or 0-10V circuit sharing
Is it feasible?...
常伴久久 ADI Reference Circuit

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2860  2822  2889  1263  1925  58  57  59  26  39 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号