HY5RS573225F-16 datasheet, PDF

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HY5RS573225F-16: DescriptionDDR DRAM, 8MX32, 0.28ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144; Categorystorage storage; File Size1MB，63 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY5RS573225F-16 Overview

DDR DRAM, 8MX32, 0.28ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144

HY5RS573225F-16 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	LFBGA, BGA144,12X12,32
Contacts	144
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.28 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	625 MHz
I/O type	COMMON
JESD-30 code	S-PBGA-B144
JESD-609 code	e1
length	12 mm
memory density	268435456 bit
Memory IC Type	DDR DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	144
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	8MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA144,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	2 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.3 mm
self refresh	YES
Continuous burst length	4
Maximum standby current	0.03 A
Maximum slew rate	1.1 mA
Maximum supply voltage (Vsup)	2.1 V
Minimum supply voltage (Vsup)	1.9 V
Nominal supply voltage (Vsup)	2 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	12 mm
Base Number Matches	1

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HY5RS573225F

256M (8Mx32) GDDR3 SDRAM

HY5RS573225F

This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any re-

sponsibility for use of circuits described. No patent licenses are implied.

Rev. 0.6 / Oct. 2004

HY5RS573225F-16 Related Products

	HY5RS573225F-16	HY5RS573225F-13	HY5RS573225F-18	HY5RS573225F-12	HY5RS573225F-20	HY5RS573225F-15	HY5RS573225F-22	HY5RS573225F-14
Description	DDR DRAM, 8MX32, 0.28ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.25ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.28ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.25ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.25ns, CMOS, PBGA144	DDR DRAM, 8MX32, 0.26ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.3ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144	DDR DRAM, 8MX32, 0.26ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144
package instruction	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	FBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	unknown	unknown	unknow
Maximum access time	0.28 ns	0.25 ns	0.28 ns	0.25 ns	0.25 ns	0.26 ns	0.3 ns	0.26 ns
Maximum clock frequency (fCLK)	625 MHz	770 MHz	555 MHz	833 MHz	500 MHz	667 MHz	455 MHz	714 MHz
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
memory density	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	32	32	32	32	32	32	32	32
Number of terminals	144	144	144	144	144	144	144	144
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
organize	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA	FBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	2 V	2 V	2 V	2 V	1.8 V	2 V	2 V	2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096	4096	4096	4096	4096
Continuous burst length	4	4	4	4	4	4	4	4
Maximum standby current	0.03 A	0.03 A	0.03 A	0.03 A	0.027 A	0.03 A	0.03 A	0.03 A
Maximum slew rate	1.1 mA	1.25 mA	1.05 mA	1.3 mA	0.7 mA	1.15 mA	0.95 mA	1.2 mA
Nominal supply voltage (Vsup)	2 V	2 V	2 V	2 V	1.8 V	2 V	2 V	2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Parts packaging code	BGA	BGA	BGA	BGA	-	BGA	BGA	BGA
Contacts	144	144	144	144	-	144	144	144
ECCN code	EAR99	EAR99	EAR99	EAR99	-	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-609 code	e1	e1	e1	e1	-	e1	e1	e1
length	12 mm	12 mm	12 mm	12 mm	-	12 mm	12 mm	12 mm
Number of functions	1	1	1	1	-	1	1	1
Number of ports	1	1	1	1	-	1	1	1
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum seat height	1.3 mm	1.3 mm	1.3 mm	1.3 mm	-	1.3 mm	1.3 mm	1.3 mm
self refresh	YES	YES	YES	YES	-	YES	YES	YES
Maximum supply voltage (Vsup)	2.1 V	2.1 V	2.1 V	2.1 V	-	2.1 V	2.1 V	2.1 V
Minimum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	-	1.9 V	1.9 V	1.9 V
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
width	12 mm	12 mm	12 mm	12 mm	-	12 mm	12 mm	12 mm
Base Number Matches	1	1	1	1	1	-	-	-

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