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M38K08F3: DescriptionRENESAS 8-BIT SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES; File Size3MB，328 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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RENESAS 8-BIT SINGLE-CHIP MICROCOMPUTER 740 FAMILY / 38000 SERIES

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REJ09B0337-0200

38K0 Group

User's Manual

RENESAS 8-BIT SINGLE-CHIP MICROCOMPUTER

740 FAMILY / 38000 SERIES

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Technology Corp. without notice. Please review the latest information published

by Renesas Technology Corp. through various means, including the Renesas Technology

Corp. website (http://www.renesas.com).

Rev. 2.00

Revision date: Oct 05, 2006

www.renesas.com

Keep safety first in your circuit designs!

Renesas Technology Corp. puts the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with

them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with ap-

propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-

flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

These materials are intended as a reference to assist our customers in the selection of the

Renesas Technology Corp. product best suited to the customer's application; they do not

convey any license under any intellectual property rights, or any other rights, belonging to

Renesas Technology Corp. or a third party.

Renesas Technology Corp. assumes no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, pro-

grams, algorithms, or circuit application examples contained in these materials.

All information contained in these materials, including product data, diagrams, charts, pro-

grams and algorithms represents information on products at the time of publication of these

materials, and are subject to change by Renesas Technology Corp. without notice due to

product improvements or other reasons. It is therefore recommended that customers con-

tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-

tributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other

loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by vari-

ous means, including the Renesas Technology Corp. Semiconductor home page (http://

www.renesas.com).

When using any or all of the information contained in these materials, including product

data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-

tion as a total system before making a final decision on the applicability of the information

and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-

ity or other loss resulting from the information contained herein.

Renesas Technology Corp. semiconductors are not designed or manufactured for use in a

device or system that is used under circumstances in which human life is potentially at

stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology

Corp. product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical,

aerospace, nuclear, or undersea repeater use.

The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-

duce in whole or in part these materials.

If these products or technologies are subject to the Japanese export control restrictions,

they must be exported under a license from the Japanese government and cannot be im-

ported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/

or the country of destination is prohibited.

Please contact Renesas Technology Corp. for further details on these materials or the

products contained therein.

General Precautions in the Handling of MPU/MCU Products

The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the

products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General

Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description

in the body of the manual takes precedence.

1. Handling of Unused Pins

Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual.



The input pins of CMOS products are generally in the high-impedance state. In operation with an

unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an

associated shoot-through current flows internally, and malfunctions occur due to the false

recognition of the pin state as an input signal become possible. Unused pins should be handled as

described under Handling of Unused Pins in the manual.

2. Processing at Power-on

The state of the product is undefined at the moment when power is supplied.



The states of internal circuits in the LSI are indeterminate and the states of register settings and pins

are undefined at the moment when power is supplied.

In a finished product where the reset signal is applied to the external reset pin, the states of pins are

not guaranteed from the moment when power is supplied until the reset process is completed.

In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function

are not guaranteed from the moment when power is supplied until the power reaches the level at

which resetting has been specified.

3. Prohibition of Access to Reserved Addresses

Access to reserved addresses is prohibited.



The reserved addresses are provided for the possible future expansion of functions. Do not access

these addresses; the correct operation of LSI is not guaranteed if they are accessed.

4. Clock Signals

After applying a reset, only release the reset line after the operating clock signal has become stable.

When switching the clock signal during program execution, wait until the target clock signal has

stabilized.



When the clock signal is generated with an external resonator (or from an external oscillator) during

a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover,

when switching to a clock signal produced with an external resonator (or by an external oscillator)

while program execution is in progress, wait until the target clock signal is stable.

5. Differences between Products

Before changing from one product to another, i.e. to one with a different type number, confirm that the

change will not lead to problems.



The characteristics of MPU/MCU in the same group but having different type numbers may differ

because of the differences in internal memory capacity and layout pattern. When changing to

products of different type numbers, implement a system-evaluation test for each of the products.

Table of contents

38K0 Group

Table of contents

CHAPTER 1 HARDWARE

DESCRIPTION ................................................................................................................................... 2

FEATURES ......................................................................................................................................... 2

PIN CONFIGURATION ..................................................................................................................... 2

FUNCTIONAL BLOCK ..................................................................................................................... 3

PIN DESCRIPTION ........................................................................................................................... 4

PART NUMBERING .......................................................................................................................... 5

GROUP EXPANSION ....................................................................................................................... 6

Memory Type ............................................................................................................................... 6

Memory Size ................................................................................................................................ 6

Packages ...................................................................................................................................... 6

FUNCTIONAL DESCRIPTION ......................................................................................................... 7

Central Processing Unit (CPU) ................................................................................................. 7

Memory ....................................................................................................................................... 11

I/O Ports ..................................................................................................................................... 13

Interrupts .................................................................................................................................... 17

Timers ......................................................................................................................................... 20

Serial Interface .......................................................................................................................... 22

USB Function ............................................................................................................................. 26

External Bus Interface (EXB) .................................................................................................. 52

Multichannel RAM ..................................................................................................................... 71

A/D Converter ............................................................................................................................ 73

Watchdog Timer ........................................................................................................................ 75

Reset Circuit .............................................................................................................................. 76

PLL Circuit (Frequency Synthesizer) ...................................................................................... 77

Clock Generating Circuit .......................................................................................................... 79

Flash Memory Mode ................................................................................................................. 82

NOTES ON PROGRAMMING ...................................................................................................... 108

NOTES ON USAGE ...................................................................................................................... 110

DATA REQUIRED FOR MASK ORDERS ................................................................................. 110

FUNCTIONAL DESCRIPTION SUPPLEMENT .......................................................................... 111

CHAPTER 2 APPLICATION

2.1 I/O port ........................................................................................................................................ 2

2.1.1 Memory map ...................................................................................................................... 2

2.1.2 Related registers ............................................................................................................... 3

2.1.3 Handling of unused pins .................................................................................................. 5

2.1.4 Notes on input and output pins ...................................................................................... 6

2.1.5 Termination of unused pins ............................................................................................. 7

2.2 Interrupt ...................................................................................................................................... 8

2.2.1 Memory map ...................................................................................................................... 8

2.2.2 Related registers ............................................................................................................... 8

2.2.3 Interrupt source ............................................................................................................... 11

2.2.4 Interrupt operation ........................................................................................................... 12

2.2.5 Interrupt control ............................................................................................................... 15

2.2.6 INT interrupt ..................................................................................................................... 18

2.2.7 Key input interrupt .......................................................................................................... 19

2.2.8 Notes on interrupts ......................................................................................................... 21

Rev.2.00 Oct 05, 2006

REJ09B0337-0200

page 1 of 13

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