REJ09B0338-0200
8
38K2 Group
User's Manual
RENESAS 8-BIT SINGLE-CHIP MICROCOMPUTER
740 FAMILY / 38000 SERIES
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Technology Corp. without notice. Please review the latest information published
by Renesas Technology Corp. through various means, including the Renesas Technology
Corp. website (http://www.renesas.com).
Rev. 2.00
Revision date: Oct 15, 2006
www.renesas.com
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the
products covered by this manual, refer to the relevant sections of the manual. If the descriptions under General
Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each other, the description
in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in the manual.
The input pins of CMOS products are generally in the high-impedance state. In operation with an
unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an
associated shoot-through current flows internally, and malfunctions occur due to the false
recognition of the pin state as an input signal become possible. Unused pins should be handled as
described under Handling of Unused Pins in the manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
The states of internal circuits in the LSI are indeterminate and the states of register settings and pins
are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the states of pins are
not guaranteed from the moment when power is supplied until the reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function
are not guaranteed from the moment when power is supplied until the power reaches the level at
which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
The reserved addresses are provided for the possible future expansion of functions. Do not access
these addresses; the correct operation of LSI is not guaranteed if they are accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has become stable.
When switching the clock signal during program execution, wait until the target clock signal has
stabilized.
When the clock signal is generated with an external resonator (or from an external oscillator) during
a reset, ensure that the reset line is only released after full stabilization of the clock signal. Moreover,
when switching to a clock signal produced with an external resonator (or by an external oscillator)
while program execution is in progress, wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different type number, confirm that the
change will not lead to problems.
The characteristics of MPU/MCU in the same group but having different type numbers may differ
because of the differences in internal memory capacity and layout pattern. When changing to
products of different type numbers, implement a system-evaluation test for each of the products.
BEFORE USING THIS MANUAL
This user’s manual consists of the following three chapters. Refer to the chapter appropriate to your conditions,
such as hardware design or software development. Chapter 3 also includes necessary information for
systems development. You must refer to that chapter.
1. Organization
q
CHAPTER 1 HARDWARE
This chapter describes features of the microcomputer and operation of each peripheral function.
q
CHAPTER 2 APPLICATION
This chapter describes usage and application examples of peripheral functions, based mainly on
setting examples of relevant registers.
q
CHAPTER 3 APPENDIX
This chapter includes necessary information for systems development using the microcomputer, such
as the electrical characteristics, the list of registers.
2. Structure of register
The figure of each register structure describes its functions, contents at reset, and attributes as follows :
(Note 2)
Bits
b7 b6 b5 b4 b3 b2 b1 b0
0
Bit attributes
(Note 1)
Contents immediately after reset release
CPU mode register (CPUM) [Address : 3B
16
]
B
0
1
2
3
4
5
6
7
Stack page selection bit
Name
Processor mode bits
b1 b0
Function
0 0 : Single-chip mode
01:
10:
Not available
11:
0 : 0 page
1 : 1 page
At reset
R W
0
0
0
0
0
1
½
½
✕
✕
Nothing arranged for these bits. These are write disabled
bits. When these bits are read out, the contents are “0.”
Fix this bit to “0.”
Main clock (X
IN
-X
OUT
) stop bit
Internal system clock selection bit
0 : Operating
1 : Stopped
0 : X
IN
-X
OUT
selected
1 : X
CIN
-X
COUT
selected
: Bit in which nothing is arranged
: Bit that is not used for control of the corresponding function
Note 1:.
Contents immediately after reset release
0....... “0” at reset release
1....... “1” at reset release
?....... Undefined at reset release
½.......Contents
determined by option at reset release
Note 2:
Bit attributes......... The attributes of control register bits are classified into 3 bytes : read-only, write-
only and read and write. In the figure, these attributes are represented as follows :
R....... Read
...... Read enabled
✕.......Read
disabled
W......Write
..... Write enabled
✕......
Write disabled
½.......“0”
write
3. Supplementation
For details of software, refer to the “740 FAMILY SOFTWARE MANUAL.”
For details of development support tools, refer to the “Renesas Technology” Homepage (http://www.renesas.com).
Table of contents
38K2 Group
Table of contents
CHAPTER 1 HARDWARE
DESCRIPTION ................................................................................................................................... 2
FEATURES ......................................................................................................................................... 2
PIN CONFIGURATION ..................................................................................................................... 2
FUNCTIONAL BLOCK ..................................................................................................................... 3
PIN DESCRIPTION ........................................................................................................................... 4
PART NUMBERING .......................................................................................................................... 5
GROUP EXPANSION ....................................................................................................................... 6
Memory Type ............................................................................................................................... 6
Memory Size ................................................................................................................................ 6
Packages ...................................................................................................................................... 6
FUNCTIONAL DESCRIPTION ......................................................................................................... 7
Central Processing Unit (CPU) ................................................................................................. 7
Memory ....................................................................................................................................... 11
I/O Ports ..................................................................................................................................... 13
Interrupts .................................................................................................................................... 17
Timers ......................................................................................................................................... 20
Serial Interface .......................................................................................................................... 22
USB Function ............................................................................................................................. 26
HUB Function ............................................................................................................................. 58
External Bus Interface (EXB) .................................................................................................. 70
Multichannel RAM ..................................................................................................................... 89
A/D Converter ............................................................................................................................ 91
Watchdog Timer ........................................................................................................................ 93
Reset Circuit .............................................................................................................................. 94
PLL Circuit (Frequency Synthesizer) ...................................................................................... 95
Clock Generating Circuit .......................................................................................................... 97
Flash Memory Mode ............................................................................................................... 100
NOTES ON PROGRAMMING ...................................................................................................... 126
NOTES ON USAGE ...................................................................................................................... 128
DATA REQUIRED FOR MASK ORDERS ................................................................................. 128
FUNCTIONAL DESCRIPTION SUPPLEMENT .......................................................................... 129
CHAPTER 2 APPLICATION
2.1 I/O port ........................................................................................................................................ 2
2.1.1 Memory map ...................................................................................................................... 2
2.1.2 Related registers ............................................................................................................... 3
2.1.3 Handling of unused pins .................................................................................................. 5
2.1.4 Notes on input and output pins ...................................................................................... 6
2.1.5 Termination of unused pins ............................................................................................. 7
2.2 Interrupt ...................................................................................................................................... 8
2.2.1 Memory map ...................................................................................................................... 8
2.2.2 Related registers ............................................................................................................... 8
2.2.3 Interrupt source ............................................................................................................... 11
2.2.4 Interrupt operation ........................................................................................................... 12
2.2.5 Interrupt control ............................................................................................................... 15
2.2.6 INT interrupt ..................................................................................................................... 18
Rev.2.00 Oct 15, 2006
REJ09B0338-0200
page 1 of 14
Embedded System
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