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AM27C020-75DC

Description
EPROM, 256KX8, 70ns, CMOS, CDIP32
Categorystorage    storage   
File Size111KB,2 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27C020-75DC Overview

EPROM, 256KX8, 70ns, CMOS, CDIP32

AM27C020-75DC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP32,.6
Reach Compliance Codeunknown
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T32
JESD-609 codee0
memory density2097152 bit
memory width8
Number of terminals32
word count262144 words
character code256000
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX8
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

AM27C020-75DC Related Products

AM27C020-75DC AM27C020-70LC AM27C020-75DI AM27C020-75LC AM27C020-75LI AM27C020-120LE AM27C020-120LEB
Description EPROM, 256KX8, 70ns, CMOS, CDIP32 EPROM, 256KX8, 70ns, CMOS, CQCC32 EPROM, 256KX8, 70ns, CMOS, CDIP32 EPROM, 256KX8, 70ns, CMOS, CQCC32 EPROM, 256KX8, 70ns, CMOS, CQCC32 EPROM, 256KX8, 120ns, CMOS, CQCC32 EPROM, 256KX8, 120ns, CMOS, CQCC32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP32,.6 QCCN, LCC32,.45X.55 DIP, DIP32,.6 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55 QCCN, LCC32,.45X.55
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns 120 ns 120 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-XDIP-T32 R-XQCC-N32 R-XDIP-T32 R-XQCC-N32 R-XQCC-N32 R-XQCC-N32 R-XQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
memory width 8 8 8 8 8 8 8
Number of terminals 32 32 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C
Minimum operating temperature - - -40 °C - -40 °C -40 °C -40 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN DIP QCCN QCCN QCCN QCCN
Encapsulate equivalent code DIP32,.6 LCC32,.45X.55 DIP32,.6 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD DUAL QUAD QUAD QUAD QUAD
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
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