EPROM, 256KX8, 70ns, CMOS, CDIP32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP32,.6 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T32 |
| JESD-609 code | e0 |
| memory density | 2097152 bit |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| AM27C020-75DC | AM27C020-70LC | AM27C020-75DI | AM27C020-75LC | AM27C020-75LI | AM27C020-120LE | AM27C020-120LEB | |
|---|---|---|---|---|---|---|---|
| Description | EPROM, 256KX8, 70ns, CMOS, CDIP32 | EPROM, 256KX8, 70ns, CMOS, CQCC32 | EPROM, 256KX8, 70ns, CMOS, CDIP32 | EPROM, 256KX8, 70ns, CMOS, CQCC32 | EPROM, 256KX8, 70ns, CMOS, CQCC32 | EPROM, 256KX8, 120ns, CMOS, CQCC32 | EPROM, 256KX8, 120ns, CMOS, CQCC32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP32,.6 | QCCN, LCC32,.45X.55 | DIP, DIP32,.6 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 120 ns | 120 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XDIP-T32 | R-XQCC-N32 | R-XDIP-T32 | R-XQCC-N32 | R-XQCC-N32 | R-XQCC-N32 | R-XQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | QCCN | DIP | QCCN | QCCN | QCCN | QCCN |
| Encapsulate equivalent code | DIP32,.6 | LCC32,.45X.55 | DIP32,.6 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | QUAD |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maker | - | - | AMD | AMD | AMD | AMD | AMD |