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AM27C010-55PI

Description
OTP ROM, 128KX8, 55ns, CMOS, PDIP32, PLASTIC, DIP-32
Categorystorage    storage   
File Size178KB,12 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

AM27C010-55PI Overview

OTP ROM, 128KX8, 55ns, CMOS, PDIP32, PLASTIC, DIP-32

AM27C010-55PI Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time55 ns
JESD-30 codeR-PDIP-T32
length42.037 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.715 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1
FINAL
Am27C010
1 Megabit (128 K x 8-Bit) CMOS EPROM
DISTINCTIVE CHARACTERISTICS
s
Fast access time
— Speed options as fast as 45 ns
s
Low power consumption
— 20 µA typical CMOS standby current
s
JEDEC-approved pinout
s
Single +5 V power supply
s
±10%
power supply tolerance standard
s
100% Flashrite™ programming
— Typical programming time of 16 seconds
s
Latch-up protected to 100 mA from –1 V to
V
CC
+ 1 V
s
High noise immunity
s
Versatile features for simple interfacing
— Both CMOS and TTL input/output compatibility
— Two line control functions
s
Standard 32-pin DIP, PDIP, and PLCC packages
GENERAL DESCRIPTION
The Am27C010 is a 1 Megabit, ultraviolet erasable pro-
grammable read-only memory. It is organized as 128K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast
single address location programming. Products are
available in windowed ceramic DIP packages, as well
as plastic one time programmable (OTP) PDIP and
PLCC packages.
Data can be typically accessed in less than 45 ns, al-
lowing high-performance microprocessors to operate
without any WAIT states. The device offers separate
Output Enable (OE#) and Chip Enable (CE#) controls,
thus eliminating bus contention in a multiple bus micro-
processor system.
AMD’s CMOS process technology provides high
speed, low power, and high noise immunity. Typical
power consumption is only 100 mW in active mode,
and 100 µW in standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in
blocks, or at random. The device supports AMD’s
Flashrite programming algorithm (100 µs pulses), re-
sulting in a typical programming time of 16 seconds.
BLOCK DIAGRAM
V
CC
V
SS
V
PP
OE#
CE#
PGM#
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
A0–A16
Address
Inputs
Output
Buffers
Data Outputs
DQ0–DQ7
Y
Gating
X
Decoder
1,048,576
Bit Cell
Matrix
10205J-1
Publication#
10205
Rev:
J
Amendment/0
Issue Date:
July 2, 1999
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