A3PE3000-FG324Y datasheet, PDF

Datasheet> All Categories > Programmable logic devices> Programmable logic> A3PE3000-FG324Y

A3PE3000-FG324Y: DescriptionField Programmable Gate Array, 350MHz, 75264-Cell, CMOS, PBGA324,; CategoryProgrammable logic devices Programmable logic; File Size8MB，162 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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A3PE3000-FG324Y Overview

Field Programmable Gate Array, 350MHz, 75264-Cell, CMOS, PBGA324,

A3PE3000-FG324Y Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	BGA, BGA324,18X18,40
Reach Compliance Code	compliant
maximum clock frequency	350 MHz
JESD-30 code	S-PBGA-B324
JESD-609 code	e0
Humidity sensitivity level	3
Number of entries	221
Number of logical units	75264
Output times	221
Number of terminals	324
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA324,18X18,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	1.5/3.3 V
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
Base Number Matches	1

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Revision 13

ProASIC3E Flash Family FPGAs

with Optional Soft ARM Support

Features and Benefits

High Capacity

• 600 k to 3 Million System Gates

• 108 to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Pro (Professional) I/O

•

700 Mbps DDR, LVDS-Capable I/Os

1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

Bank-Selectable I/O Voltages—up to 8 Banks per Chip

Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS

2.5 V / 5.0 V Input

Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS

Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL

2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3

Class I and II

I/O Registers on Input, Output, and Enable Paths

Hot-Swappable and Cold Sparing I/Os

Programmable Output Slew Rate and Drive Strength

Programmable Input Delay

Schmitt Trigger Option on Single-Ended Inputs

Weak Pull-Up/-Down

IEEE 1149.1 (JTAG) Boundary Scan Test

Pin-Compatible Packages across the ProASIC

3E Family

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

On-Chip User Nonvolatile Memory

• 1 kbit of FlashROM with Synchronous Interfacing

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock

Designed to Secure FPGA Contents

Clock Conditioning Circuit (CCC) and PLL

• Six CCC Blocks, Each with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Low Power

• Core Voltage for Low Power

• Support for 1.5-V-Only Systems

• Low-Impedance Flash Switches

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• 24 SRAM and FIFO Configurations with Synchronous Operation

up to 350 MHz

• M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available

with or without Debug

High-Performance Routing Hierarchy

•

Segmented, Hierarchical Routing and Clock Structure

Ultra-Fast Local and Long-Line Network

Enhanced High-Speed, Very-Long-Line Network

High-Performance, Low-Skew Global Network

Architecture Supports Ultra-High Utilization

ARM

Processor Support in ProASIC3E FPGAs

Table 1-1 • ProASIC3E Product Family

ProASIC3E Devices

Cortex-M1 Devices

System Gates

VersaTiles (D-flip-flops)

RAM Kbits (1,024 bits)

4,608-Bit Blocks

FlashROM Kbits

Secure (AES) ISP

CCCs with Integrated

VersaNet

Globals

I/O Banks

Maximum User I/Os

Package Pins

PQFP

FBGA

PLLs

600,000

13,824

108

Yes

270

PQ208

FG256, FG484

A3PE600

A3PE1500

M1A3PE1500

1,500,000

38,400

270

Yes

444

PQ208

FG484, FG676

A3PE3000

M1A3PE3000

3,000,000

75,264

504

112

Yes

620

PQ208

FG324

FG484, FG896

Notes:

1. Refer to the

Cortex-M1

product brief for more information.

2. The PQ208 package supports six CCCs and two PLLs.

3. Six chip (main) and three quadrant global networks are available.

4. For devices supporting lower densities, refer to the

ProASIC3 Flash Family FPGAs

datasheet.

January 2013

ProASIC3E Flash Family FPGAs

Table of Contents

ProASIC3E Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3E DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-63

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-67

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-69

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-71

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-82

Pin Descriptions and Packaging

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User-Defined Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-3

3-4

Package Pin Assignments

PQ208

FG256

FG324

FG484

FG676

FG896

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-40

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11

R ev i si o n 1 3

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