AM29BDD160GT65AKE datasheet, PDF

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AM29BDD160GT65AKE: DescriptionFlash, 512KX32, 67ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80; Categorystorage storage; File Size1MB，79 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29BDD160GT65AKE Overview

Flash, 512KX32, 67ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80

AM29BDD160GT65AKE Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	PLASTIC, MO-108CB-1, QFP-80
Contacts	80
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	67 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
Spare memory width	16
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PQFP-G80
JESD-609 code	e0
length	20 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	32
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,30
Number of terminals	80
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	512KX32
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP80,.7X.9,32
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	1.8/2.6,2.6 V
Programming voltage	2.7 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	3.35 mm
Department size	8K,64K
Maximum standby current	0.00006 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	2.75 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.6 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	14 mm
Base Number Matches	1

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Am29BDD160G

Data Sheet

For new designs, S29CD016G supersedes Am29BDD160G and is the factory-recommended migration

path for this device. Please refer to the S29CD016G datasheet for specifications and ordering infor-

mation.

The following document contains information on Spansion memory products. Although the doc-ument

is marked with the name of the company that originally developed the specification, Spansion will

continue to offer these products to existing customers.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when

appro-priate, and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

Spansion continues to support existing part numbers beginning with “Am” and “MBM”. To order these

products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

24960

Revision

Amendment

Issue Date

June 7, 2006

TABLE OF CONTENTS

Product

Selector

Guide

. . . . . . . . . . . . . . . . . . . . .

Block Diagram

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Block Diagram of

Simultaneous

Operation Circuit

. . . . . . . . . . . . .

Connection Diagram

. . . . . . . . . . . . . . . . . . . . . . . .

Special Package Handling Instructions .................................... 8

Pin Configuration

. . . . . . . . . . . . . . . . . . . . . . . . . .

Logic

Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . .

x16 Mode .................................................................................. 9

x32 Mode .................................................................................. 9

Ordering Information

. . . . . . . . . . . . . . . . . . . . . .

Device Bus Operations

. . . . . . . . . . . . . . . . . . . . .

Table 1. Device Bus Operation .......................................................12

Dynamic Protection Bit (DYB) ............................................. 25

Table 11. Sector Protection Schemes ............................................ 26

VersatileI/O™ (V

) Control .................................................... 13

Requirements for Reading Array Data ................................... 13

Simultaneous Read/Write

Operations Overview and Restrictions ................................... 13

Overview ............................................................................. 13

Restrictions .......................................................................... 13

Table 2. Bank Assignment for Boot Bank

Sector Devices ................................................................................13

Persistent Sector Protection Mode Locking Bit ....................... 26

Password Protection Mode ..................................................... 26

Password and Password Mode Locking Bit ............................ 26

64-bit Password ................................................................... 27

Write Protect (WP#) ................................................................ 27

SecSi™ (Secured Silicon) Sector Protection .......................... 27

SecSi Sector Protection Bit ..................................................... 28

Persistent Protection Bit Lock ................................................. 28

Hardware Data Protection ...................................................... 28

Low V

Write Inhibit ........................................................... 28

Write Pulse “Glitch” Protection ............................................ 28

Logical Inhibit ....................................................................... 28

Power-Up Write Inhibit ......................................................... 28

and V

Power-up And Power-down Sequencing ......... 28

Table 12. Sector Addresses for Top Boot Sector Devices ............. 29

Table 13. Sector Addresses for Bottom Boot Sector Devices ........ 30

Table 14. CFI Query Identification String ....................................... 31

Table 15. CFI System Interface String ........................................... 31

Table 16. CFI Device Geometry Definition ..................................... 32

Table 17. CFI Primary Vendor-Specific Extended Query ............... 32

Simultaneous Read/Write Operations With Zero Latency ...... 13

Table 3. Top Boot Bank Select .......................................................14

Table 4. Bottom Boot Bank Select ..................................................14

Writing Commands/Command Sequences ............................ 14

Accelerated Program and Erase Operations ....................... 14

Autoselect Functions ........................................................... 14

Automatic Sleep Mode (ASM) ................................................ 14

RESET#: Hardware Reset Pin ............................................... 15

Output Disable Mode .............................................................. 15

Autoselect Mode ..................................................................... 15

Table 5. Am29BDD160 Autoselect Codes (High Voltage Method) .16

Command Definitions

. . . . . . . . . . . . . . . . . . . . . 34

Reading Array Data in Non-burst Mode .................................. 34

Reading Array Data in Burst Mode ......................................... 34

Read/Reset Command ........................................................... 34

Autoselect Command ............................................................. 35

Program Command Sequence ............................................... 35

Accelerated Program Command ............................................ 35

Unlock Bypass Command Sequence ..................................... 35

Figure 4. Program Operation ......................................................... 36

Asynchronous Read Operation (Non-Burst) ........................... 16

Figure 1. Asynchronous Read Operation........................................ 16

Synchronous (Burst) Read Operation .................................... 17

Linear Burst Read Operations ................................................ 17

Table 6. 16-Bit and 32-Bit Linear and Burst Data Order .................17

CE# Control in Linear Mode ................................................ 18

ADV# Control In Linear Mode .............................................. 18

RESET# Control in Linear Mode ......................................... 18

OE# Control in Linear Mode ................................................ 18

IND/WAIT# Operation in Linear Mode ................................. 18

Table 7. Valid Configuration Register Bit Definition for IND/WAIT# 20

Figure 2. End of Burst Indicator (IND/WAIT#) Timing for Linear 8-Word

Burst Operation............................................................................... 20

Unlock Bypass Entry Command .......................................... 36

Unlock Bypass Program Command .................................... 36

Unlock Bypass Chip Erase Command ................................ 36

Unlock Bypass CFI Command ............................................ 36

Unlock Bypass Reset Command ......................................... 37

Chip Erase Command ............................................................ 37

Sector Erase Command ......................................................... 37

Figure 5. Erase Operation.............................................................. 38

Sector Erase and Program Suspend Command .................... 38

Sector Erase and Program Suspend Operation Mechanics ... 38

Table 18. Allowed Operations During Erase/Program Suspend ... 38

Burst Access Timing Control ............................................... 21

Initial Burst Access Delay Control ....................................... 21

Table 8. Burst Initial Access Delay ..................................................21

Figure 3. Initial Burst Delay Control ................................................ 21

Configuration Register ............................................................ 22

Table 9. Configuration Register Definitions .....................................22

Table 10. Configuration Register After Device Reset .....................24

Initial Access Delay Configuration .......................................... 24

Sector

Protection

. . . . . . . . . . . . . . . . . . . . . . . .

Persistent Sector Protection ................................................... 24

Persistent Protection Bit (PPB) ............................................ 25

Persistent Protection Bit Lock (PPB Lock) .......................... 25

Sector Erase and Program Resume Command ..................... 39

Configuration Register Read Command ................................. 39

Configuration Register Write Command ................................. 39

Common Flash Interface (CFI) Command .............................. 39

SecSi Sector Entry Command ................................................ 41

Password Program Command ................................................ 41

Password Verify Command .................................................... 41

Password Protection Mode Locking Bit Program Command .. 42

Persistent Sector Protection Mode Locking Bit Program Com-

mand ....................................................................................... 42

SecSi Sector Protection Bit Program Command .................... 42

PPB Lock Bit Set Command ................................................... 42

DYB Write Command ............................................................. 42

Password Unlock Command .................................................. 42

PPB Program Command ........................................................ 43

June 7, 2006

Am29BDD160G

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