ACS174MS
Data Sheet
July 1999
File Number
4762
Radiation Hardened Hex D-Type Flip-Flop
with Reset
The Radiation Hardened ACS174MS is a Hex D-Type Flip-
Flop with Reset. Information at the D input is transferred to
the Q output on the positive-going transition of the clock. All
six flip-flops are controlled by a common clock (CP) and a
common reset (MR). Resetting is accomplished by a LOW
level independent of the clock. All inputs are buffered and
the outputs are designed for balanced propagation delay
and transition times.
The ACS174MS is fabricated on a CMOS Silicon on
Sapphire (SOS) process, which provides an immunity to
Single Event Latch-up and the capability of highly reliable
performance in any radiation environment. These devices
offer significant power reduction and faster performance
when compared to ALSTTL types.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the ACS174MS are
contained in SMD 5962-98634. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/spaceselect.htm
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• 1.25 Micron Radiation Hardened SOS CMOS
• Radiation Environment
- Latch-Up Free Under Any Conditions
- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10
5
RAD(Si)
- SEU Immunity . . . . . . . . . . . . . <1 x 10
-10
Errors/Bit/Day
- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm
2
)
• Input Logic Levels. . . . V
IL
= (0.3)(V
CC
), V
IH
= (0.7)(V
CC
)
• Output Current
. . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA
(Min)
• Quiescent Supply Current . . . . . . . . . . . . . . . 10µA (Max)
• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 23ns (Max)
Applications
• High Speed Control Circuits
• Sensor Monitoring
• Low Power Designs
Ordering Information
ORDERING NUMBER
5962F9863401VCC
ACS174D/SAMPLE-03
5962F9863401VXC
ACS174K/SAMPLE-03
5962F9863401V9A
INTERNAL MARKETING
NUMBER
ACS174DMSR-03
ACS174D/SAMPLE-03
ACS174KMSR-03
ACS174K/SAMPLE-03
ACS174HMSR-03
TEMP. RANGE (
o
C)
-55 to 125
25
-55 to 125
25
25
PACKAGE
16 Ld SBDIP
16 Ld SBDIP
16 Ld Flatpack
16 Ld Flatpack
Die
DESIGNATOR
CDIP2-T16
CDIP2-T16
CDFP4-F16
CDFP4-F16
NA
Pinouts
ACS174MS
(SBDIP)
TOP VIEW
MR 1
Q0 2
D0 3
D1 4
Q1 5
D2 6
Q2 7
GND 8
16 V
CC
15 Q5
14 D5
13 D4
12 Q4
11 D3
10 Q3
9 CP
MR
Q0
D0
D1
Q1
D2
Q2
GND
ACS174MS
(FLATPACK)
TOP VIEW
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
Q5
D5
D4
Q4
D3
Q3
CP
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
ACS174MS
Die Characteristics
DIE DIMENSIONS:
Size: 2390µm x 2390µm (94 mils x 94 mils)
Thickness: 525µm
±25µm
(20.6 mils
±1
mil)
Bond Pad: 110µm x 110µm (4.3 x 4.3 mils)
METALLIZATION: AI
Metal 1 Thickness: 0.7µm
±0.1µm
Metal 2 Thickness: 1.0µm
±0.1µm
SUBSTRATE POTENTIAL
Unbiased Insulator
PASSIVATION:
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30µm
±0.15µm
SPECIAL INSTRUCTIONS
Bond V
CC
First
ADDITIONAL INFORMATION:
Worst Case Current Density: <2.0 x 10
5
A/cm
2
Transistor Count: 358
Metallization Mask Layout
ACS174MSX
Q0
(2)
MR
(1)
V
CC
(16)
Q5
(15)
D0 (3)
(14) D5
D1 (4)
(13) D4
Q1 (5)
(12) Q4
D2 (6)
(11) D3
(7)
Q2
(8)
GND
(9)
CP
(10)
Q3
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
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Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
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