ACT-S512K32N-055F2C datasheet, PDF

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ACT-S512K32N-055F2C: DescriptionCache SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68; Categorystorage storage; File Size368KB，9 Pages; ManufacturerCobham Semiconductor Solutions

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ACT-S512K32N-055F2C Overview

Cache SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68

ACT-S512K32N-055F2C Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	QFP,
Contacts	68
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	55 ns
Other features	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16
JESD-30 code	S-CQFP-G68
length	22.352 mm
memory density	16777216 bit
Memory IC Type	CACHE SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	22.352 mm
Base Number Matches	1

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ACT–S512K32 High Speed

16 Megabit SRAM Multichip Module

Features

■

4 Low Power CMOS 512K x 8 SRAMs in one MCM

■

Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8

■

Input and Output TTL & CMOS Compatible Design

■

Fast 17,20,25,35,45,55ns Access Times

■

Full Commercial, Industrial and Military (-55°C to +125°C)

CIRCUIT TECHNOLOGY

www.aeroflex.com

General Description

The ACT–S512K32 is a High

Speed, 16 megabit CMOS

SRAM

Multichip

Module

(MCM) designed for full

temperature range industrial,

military, or space, mass

memory and fast cache

applications.

The MCM can be organized

as a 512K x 32 bit, 1M x 16 bit

or 2M x 8 bit device and is

input

and

output

TTL

compatible. Writing is executed

when the write enable (WE)

and chip enable (CE) inputs

are low and output enable (OE)

input is high. Reading is

accomplished when WE is high

and CE and OE are both low.

Access time grades of 17ns,

20ns, 25ns, 35ns, 45ns and

55ns maximum are standard

high speed versions.

The +5 Volt power supply

version is standard and +3.3

Volt lower power model is a

future optional product.

The products are designed

for

operation

over

the

temperature range of -55°C to

+125°C and under the full

military environment. DESC

Standard Military Drawing

(SMD) numbers are released.

The

ACT-S512K32

manufactured in Aeroflex’s

80,000

square

foot

MIL-PRF-38534

certified

facility in Plainview, N.Y.

Temperature Range

■

MIL-PRF-38534 Compliant MCMs Available

■

+5 V Power Supply

■

Available in two Surface Mount Packages, and two PGA Type Package

●

68–Lead, Low Profile CQFP(F1), 1.56"SQ x .140"max

68–Lead, Dual-Cavity CQFP(F2), 0.88"SQ x .20"max

(.18 max thickness available, contact factory for details)

(Drops into the 68 Lead JEDEC .99"SQ CQFJ footprint)

●

68–Lead, Single-Cavity CQFP (F18), .94"SQ x .140"max

(Drops into the 68

Lead JEDEC .99"SQ CQFJ footprint)

●

66 Pin, 1.38" x 1.38" x .245" PGA Type, Aeroflex code# "P1"

●

66 Pin, 1.09" x 1.09" x .185" PGA Type, With Shoulder, Aeroflex code# "P7"

■

Internal Decoupling Capacitors

■

DESC SMD# 5962–94611 Released (F1,F2,F18,P1,P7)

Block Diagram – PGA Type Package (P1,P7) & CQFP (F2,F18)

Pin Description

I/O

0-31

– A

512Kx8

0–18

1–4

I/O

0-7

I/O

8-15

I/O

16-23

I/O

24-31

GND

Data I/O

Address Inputs

Write Enables

Chip Enables

Output Enable

Power Supply

Ground

Not Connected

Block Diagram – CQFP(F1)

Pin Description

– A

512Kx8

I/O

0-31

0–18

1–4

I/O

0-7

I/O

8-15

16-23

I/O

24-31

GND

Data I/O

Address Inputs

Write Enable

Chip Enables

Output Enable

Power Supply

Ground

Not Connected

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