PEEL153C-35 datasheet, PDF - EEWORLD Datasheet

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PEEL153C-35: DescriptionEE PLD, 35ns, PLA-Type, CMOS, CDIP20; CategoryProgrammable logic devices Programmable logic; File Size233KB，4 Pages; ManufacturerIntegrated Circuit Systems（IDT ）

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PEEL153C-35 Overview

EE PLD, 35ns, PLA-Type, CMOS, CDIP20

PEEL153C-35 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
Architecture	PLA-TYPE
JESD-30 code	R-XDIP-T20
JESD-609 code	e0
Number of entries	18
Output times	10
Number of product terms	42
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Programmable logic type	EE PLD
propagation delay	35 ns
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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PEEL153C-35 Related Products

	PEEL153C-35	PEEL153C-30	PEEL153P-30	PEEL153C-40	PEEL153P-35	PEEL153P-40
Description	EE PLD, 35ns, PLA-Type, CMOS, CDIP20	EE PLD, 30ns, PLA-Type, CMOS, CDIP20	EE PLD, 30ns, PLA-Type, CMOS, PDIP20	EE PLD, 40ns, PLA-Type, CMOS, CDIP20	EE PLD, 35ns, PLA-Type, CMOS, PDIP20	EE PLD, 40ns, PLA-Type, CMOS, PDIP20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Architecture	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE	PLA-TYPE
JESD-30 code	R-XDIP-T20	R-XDIP-T20	R-PDIP-T20	R-XDIP-T20	R-PDIP-T20	R-PDIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of entries	18	18	18	18	18	18
Output times	10	10	10	10	10	10
Number of product terms	42	42	42	42	42	42
Number of terminals	20	20	20	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Programmable logic type	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD	EE PLD
propagation delay	35 ns	30 ns	30 ns	40 ns	35 ns	40 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1

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