MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1.1GHz Prescaler With
Stand-By Mode
The MC12083 is a
÷2
prescaler for low power frequency division of a
1.1GHz high frequency input signal. On–chip output termination provides
output current to drive a 2pF (typical) high impedance load. If additional
drive is required for the prescaler output, an external resistor can be
added parallel from the OUT Pin to GND to increase the output power.
Care must be taken not to exceed the maximum allowable current
through the output.
Stand–By mode is featured to reduce current drain to 250µA typical
when the stand–by pin SB is switched LOW disabling the prescaler.
MC12083
MECL PLL COMPONENTS
÷2
PRESCALER
WITH STAND–BY MODE
•
•
•
•
•
1.1GHz Toggle Frequency
Supply Voltage 2.7V to 5.5V
Low Power 4.5mA Typical at VCC = 2.7V
Operating Temperature –40 to +85°C
On–Chip Termination
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
Pinout: 8–Lead Plastic
(Top View)
IN
8
SB
7
NC
6
GND
5
D SUFFIX
8–LEAD PLASTIC SOIC PACKAGE
CASE 751–05
1
2
3
4
IN
VCC
NC
OUT
A LOW on the Stand–By Pin 7 disables the device.
MAXIMUM RATINGS
Symbol
VCC
TA
Tstg
IO
Parameter
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Maximum Output Current, Pin 4
Value
–0.5 to +7.0
–40 to +85
–65 to +150
10.0
Unit
VDC
°C
°C
mA
1/97
©
Motorola, Inc. 1997
1
REV 2
MC12083
ELECTRICAL CHARACTERISTICS
(VCC = 2.7 to 5.5V; TA = –40 to +85°C)
Symbol
ft
ICC
ISB
VIH
VIL
VOUT
Parameter
Toggle Frequency (Sine Wave)
Supply Current Output (Pin 2)
Standby Current
Standby Input HIGH (SB)
Standby Input LOW (SB)
Output Voltage Swing (Note 1.)
2pF Load @ 500MHz Input
2pF Load @ 750MHz Input
2pF Load @ 1100MHz Input
100–250MHz
250–400MHz
400–1100MHz
VCC = 3.0V
VCC = 5.5V
VCC = 3.0V
VCC = 5.5V
2.0
GND
700
600
400
400
200
100
800
700
450
1000
1000
1000
Min
0.1
Typ
1.4
4.4
4.8
250
500
Max
1.1
6.5
6.5
350
600
VCC
0.8
Unit
GHz
mA
µA
V
V
mVPP
VIN
Input Voltage Sensitivity
mVPP
1. Assume 2pF load, VCC = 2.7V, VIN =minimum specification for each frequency band, TA = 85°C
VCC = 2.7 to 5.5V
C3
Sine Wave Generator
C1
50Ω
C2
IN
GND
IN
VCC
SB
OUT
2pF
EXTERNAL COMPONENTS
C1 = C2 = 1000pF
C3 = 0.1µF
Figure 1. AC Test Circuit
MOTOROLA
2
HIPERCOMM
BR1334 — Rev 4
MC12083
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
8
5
–B–
1
4
F
NOTE 2
–A–
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
–T–
SEATING
PLANE
J
N
D
K
M
M
H
G
0.13 (0.005)
T A
M
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10
_
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10
_
0.030
0.040
B
M
A
8
D
5
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE R
C
H
0.25
M
E
1
4
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
_
7
_
B
C
e
h
A
SEATING
PLANE
X 45
_
q
0.10
A1
0.25
B
M
L
C B
S
A
S
q
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◊
MOTOROLA
4
MC12083/D
HIPERCOMM
BR1334 — Rev 4