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ACT-RS128K32N-045P1T

Description
RAD Tolerant ACT-RS128K32 High Speed 4 Megabit SRAM Multichip Module
File Size136KB,8 Pages
ManufacturerAeroflex
Websitehttp://www.aeroflex.com/
Download Datasheet View All

ACT-RS128K32N-045P1T Overview

RAD Tolerant ACT-RS128K32 High Speed 4 Megabit SRAM Multichip Module

RAD Tolerant
ACT–RS128K32 High Speed
4 Megabit SRAM Multichip Module
Features
s
Overall configuration as 128K x 32
s
Tolerant to 30KRad (Si)
s
Latch-up Immunity to 112MeV/(mg/cm
2
)
s
Input and Output TTL Compatible
s
35 & 45ns Access Times
s
Full Military (-55°C to +125°C) Temperature Range
s
For Class K devices per MIL-PRF-38534 - Consult Factory
s
+5V Power Supply
s
Choice of 4 Hermetically sealed Co-fired Packages:
q
68–Lead, Low Profile CQFP (F1), 1.56"SQ x .140"max
q
68–Lead, Dual-Cavity CQFP (F2), .88"SQ x .20"max (.18"max thickness
available, contact factory for details)
(Drops into the 68 Lead JEDEC .99"SQ
CQFJ footprint)
q
66–Lead, PGA-Type (P1), 1.385"SQ x .245"max
s
Internal Decoupling Capacitors
www.aeroflex.com/act1.htm
Preliminary
s
4 Low Power CMOS 128K x 8 SRAMs in one MCM
CIRCUIT TECHNOLOGY
General Description
The ACT–RS128K32 is a High
Speed 4 megabit CMOS SRAM
Multichip
Module
(MCM)
designed for full temperature
range, military, space, or high
reliability mass memory and
fast cache applications.
The MCM can be organized
as a 128K x 32 bits, 256K x 16
bits or 512k x 8 bits device and
is input and output TTL
compatible. Writing is executed
when the write enable (WE)
and chip enable (CE) inputs are
low. Reading is accomplished
when WE is high and CE and
output enable (OE) are both
low. Access time grades of
35ns and 45ns maximum are
standard.
The +5 Volt power supply
version is standard.
The products are designed for
operation over the temperature
range of -55°C to +125°C and
screened under the full military
environment. DESC Standard
Military Drawing (SMD) part
numbers are pending.
The
ACT-RS128K32
is
manufactured in Aeroflex’s
80,000ft
2
MIL-PRF-38534
certified facility in Plainview,
N.Y.
Block Diagram – PGA Type Package(P1) & CQFP(F2)
Pin Description
WE
1
CE
1
WE
2
CE
2
WE
3
CE
3
WE
4
CE
4
I/O
0-31
A
0
– A
16
OE
128Kx8
128Kx8
128Kx8
128Kx8
A
0–16
WE
1–4
CE
1–4
OE
V
cc
8
I/O
0-7
8
I/O
8-15
8
I/O
16-23
8
I/O
24-31
GND
NC
Data I/O
Address Inputs
Write Enables
Chip Enables
Output Enable
Power Supply
Ground
Not Connected
Block Diagram – CQFP(F1)
Pin Description
CE
1
WE
OE
A
0
– A
16
128Kx8
128Kx8
128Kx8
128Kx8
CE
2
CE
3
CE
4
I/O
0-31
A
0–16
WE
CE
1–4
OE
V
cc
8
I/O
0-7
8
I/O
8-15
8
I/O
16-23
8
I/O
24-31
GND
NC
Data I/O
Address Inputs
Write Enable
Chip Enables
Output Enable
Power Supply
Ground
Not Connected
eroflex Circuit Technology - Advanced Multichip Modules © SCD3659 REV 3 12/17/98

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