EEWORLDEEWORLDEEWORLD

Part Number

Search

SSW-147-02-TM-D-LL

Description
Board Connector, 94 Contact(s), 2 Row(s), Female, Straight, Solder Kinked Leads Terminal, Locking, Black Insulator
CategoryThe connector    The connector   
File Size529KB,3 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

SSW-147-02-TM-D-LL Overview

Board Connector, 94 Contact(s), 2 Row(s), Female, Straight, Solder Kinked Leads Terminal, Locking, Black Insulator

SSW-147-02-TM-D-LL Parametric

Parameter NameAttribute value
Reach Compliance Codecompliant
body width0.195 inch
subject depth0.335 inch
body length4.72 inch
Connector typeBOARD CONNECTOR
Contact to complete cooperationSN ON NI
Contact completed and terminatedTIN OVER NICKEL
Contact point genderFEMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact resistance10 mΩ
Contact styleSQ PIN-SKT
Durability100 Cycles
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
Manufacturer's serial numberSSW
Match contact row spacing0.1 inch
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing2.54 mm
polarization keyPOLARIZED HOUSING
Rated current (signal)6.3 A
GuidelineUL, CSA
reliabilityCOMMERCIAL
Terminal length0.194 inch
Terminal pitch2.54 mm
Termination typeSOLDER KINKED LEADS
Total number of contacts94
Base Number Matches1
REVISION CA
DO NOT
SCALE FROM
THIS PRINT
SSW-1XX-XX-XXX-X-XX-XXX-XX
No OF POSITIONS
-01 THRU -50
(-P OPTION: 36 POS MAX)
LEAD STYLE
(SEE TABLE 1)
-01 THRU -06 (STD. INS. FORCE)
-21 THRU -24 (LOW INS. FORCE)
OPTION
-LL: LOCKING LEAD
(SEE FIG 4, SHT 2)
(N/A IN SINGLE ROW,
1 & 2 POSITION)
POLARIZING OPTION
INDICATE POS, SEE FIG 3, SHT 3
OPTION
-RA: RIGHT ANGLE (SEE FIG 2, SHT 2)
(STYLE -01 & -21 N/A)
-N: NOTCH (SEE FIG 6, SHT 3)
(ONLY AVAILABLE IN -D ROW)
(ONLY AVAILABLE IN 5, 7, 8, 10, 12,
13, 15, 17, 20, 25, 32, 36 POSITIONS)
(USE NSW-XX-D-N-XX BODY,
SEE TABLE 6)
PLATING SPECIFICATION
-G: 20µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-T: MATTE TIN CONTACT AND TAIL
(CONTACT -21 THRU -24 N/A)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
ROW SPECIFICATION
3µ" GOLD ON TAIL
-E: 50µ" EXTRA HEAVY GOLD IN CONTACT AREA,
-S: SINGLE
3µ" GOLD ON TAIL
-D: DOUBLE
(CONTACT -01 & -02 STRAIGHT ONLY)
-T: TRIPLE
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA,
-P: SINGLE
MATTE TIN ON TAIL
-Q: TRIPLE WITH ONLY OUTER 2 ROWS
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA,
FILLED
TIN/LEAD (90/10 ± 5%) TAIL
-TL: TIN/LEAD (90/10 ± 5%) CONTACT AND TAIL
(AVAILABLE ONLY ON LEAD STYLES -01)
-TM: MATTE TIN CONTACT AND TAIL (CONTACT -21 THRU -24 N/A)
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-FM: 3µ" FLASH GOLD SELECTIVE IN CONTACT AREA,
MATTE TIN ON TAIL
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.050 1.27 REF
((No. OF POS x .10[2.5]) + .02[0.5])
SEE NOTE 10
.0110 0.280
REF
.095 2.41
REF
.095 2.41
REF
.245 6.22
.195 4.95
REF
SEE NOTE 8
.295 7.49
REF
60°
.335 8.51
DETAIL 'A'
SCALE 4 : 1
SEE NOTE 5
NOTES:
'A'
*"B"
.031 0.79 X .016[0.41]
REF (TYP)
+.000
*"B"
- .005
FOR
-S
MACHINE FILL ONLY
-P
.100 2.54
"G"
-D
FIG 1
-D-N
.100 2.54
"G"
.200 5.08
-T
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MAXIMUM CUT FLASH: .015[.38] WITH NO FLASH BELOW STANDOFFS OR IN CONTACT HOLES.
3. MINIMUM CONTACT PUSHOUT FORCE: 1.5 LBS.
4. MAXIMUM ALLOWABLE BOW: .003[.08] INCH/INCH.
5. MAXIMUM ALLOWABLE SWAY: 2° (TYP) FOR HAND FILL & 1° (TYP) FOR MACHINE FILL.
6. MAXIMUM ALLOWABLE VARIATION BETWEEN ROWS: .010[.25].
7. "END WALLS" AFTER CUTTING SHOULD BE .020±.003 [.51±.08].
8. NOTCH ON -P-RA & -D-RA-N OPTIONS TO BE ORIENTED AS SHOWN.
9. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION.
10. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION
FOR MACHINE FILL.
11. LEAD STYLE X2 (SINGLE AND DOUBLE) -RA's TO BE LAYER PACKAGED. ALL OTHER -RA
LEAD STYLES: UNDER 5 POSITION TO BE LAYER PACKAGED, 5 AND UP TO BE PACKAGED
IN TUBES.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
.XXX: .005 [.13]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
-S, -D, -D-N: VECTRA E130i, COLOR: BLACK UL94 V0
-P, -T: PCT, COLOR: BLACK UL94 V0
CONTACT: PHOSPHOR BRONZE, SPRING TEMPER
ALLOY 511 OR 510
(TENSILE STRENGTH 90-100 KSI)
(YEILD STRENGTH @ 2% OFFSET 88-98 KSI)
PER MIL-B-13501
THICKNESS: .0160±.001 [0.635±0.03]
F:\DWG\MISC\MKTG\SSW-1XX-XX-XXX-X-XX-XXX-XX-MKT.SLDDRW
SHEET SCALE: 2:1
ASSEMBLY, SOCKET STRIP .016 X .031 TAIL
SSW-1XX-XX-XXX-X-XX-XXX-XX
06/12/1987
SHEET
1
OF
3
BY:
PURVIS
[NXP Rapid IoT Review] + Summary of Bluetooth protocol stack usage
[i=s]This post was last edited by manhuami2007 on 2019-1-20 20:15[/i]How does the Rapid iot kit use Bluetooth for communication? Bluetooth communication is performed by simulating the Bluetooth protoc...
manhuami2007 RF/Wirelessly
How to export bsp installation package in wince6.0
As mentioned in the question, in 5.0, you can export through platform-->export wizard, but there is no similar instruction in 6.0. How can I do it?...
7628950 Embedded System
There is a problem downloading the new 9B96 board, please help
When I use ULINK to download the new 9B96 board, it prompts "Cannot load Flash programming Algorithms!"What is this problem, and how to solve it?...
sptt1 Microcontroller MCU
EEWORLD University New Course Express Issue 2: Covering multiple fields such as robots, algorithms, black technology, CNC, FPGA, etc.
Tutorials by famous college teachersChinese subtitles for foreign tutorialsIndustry engineer forumsNational College Student Electronics Competition related... Involving robots, algorithms, black techn...
EE大学堂 Robotics Development
DA14580 Notes on establishing a compilation platform --KEIL
There is no special CPU to choose under KEIL, so it is different from the usual method of building a project. 1. Select the general Cortex-M0 CPU. 2. Select the SCT file provided by Dialog to allocate...
dontium RF/Wirelessly
Single chip microcomputer low power consumption technology and its application
This paper introduces the technical characteristics of low-power design of single-chip microcomputers and several issues that should be paid attention to in low-power design of single-chip microcomput...
rain MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1048  1838  846  1273  2846  22  38  18  26  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号