MA4BN1840-2
Monolithic HMIC™
Integrated Bias Network
Features
♦
♦
♦
♦
♦
Broad Bandwidth Specified 18 to 40GHz
Usable 10GHz to 50 GHz
Extremely Low Insertion Loss
High RF-DC Isolation
Rugged, Fully Monolithic Glass Encapsulation
RoHS Compliant
Rev. V3
Description
The MA4BN1840-2 is a fully monolithic broadband bias
network utilizing M/A-COM's HMIC (Heterolithic Micro-
wave Integrated Circuit) process, US Patent 5,268,310.
This process allows the formation of silicon vias by
imbedding them in low loss, low dispersion glass along
with high Q spiral inductors and MIM capacitors. The
close proximity between elements and the combination
of silicon and glass gives this HMIC device low loss and
high performance with exceptional repeatability through
millimeter frequencies.
TM
Yellow areas denote bond pads
Large bond pads facilitate the use of low inductance
ribbon bonds, while the gold backside metallization
provides the RF and DC ground. This allows for manual
or automatic die attach via electrically conductive silver
epoxy or RoHS compliant solders.
.
Schematic
Applications
The MA4BN1840-2 bias network is suitable for the
D.C. biasing of PIN diode control circuits. It functions
as an RF-DC de-coupling network as well as the D.C.
return. The device can also be used as a bi-directional
re-active coupler for Schottky detector circuits. D.C.
currents up to 150 mA and D.C. voltages up to 50 V
may be used.
J1 (IN)
J2 (OUT)
Maximum Operating Conditions at +25°C
(Unless otherwise noted)
Parameter
Operating Temperature
Storage Temperature
Die Attach Temperature
RF C.W. Incident Power
D.C. Bias Current
D.C. Bias Voltage
D.C.
Ground
B1
B2
D.C. Bias #1 D.C. Bias #2
D.C.
Ground
Value
-65°C to +125°C
-65°C to +150°C
320°C for 20 sec
10 Watts
+/- 150 mA
+/- 50 V
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4BN1840-2
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
Rev. V3
Electrical Specifications @ T
AMB
= +25
o
C on Wafer Measurements
Parameter
Frequency
Minimum
Value
Average
Value
Maximum
Value
Units
Insertion Loss
RF - DC Isolation
Input Return Loss
Output Return Loss
18-40 GHz
18-40 GHz
18-40 GHz
18-40 GHz
-
30
15
15
0.25
35
17
17
0.4
-
-
-
dB
dB
dB
dB
Typical RF Performance at T
A
= +25°C
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
Loss (dB)
J1-J2 Insertion Loss
-0.6
-0.7
-0.8
-0.9
-1.0
10
15
20
25
30
Freq. (GHz)
35
40
45
50
0
-5
-10
-15
Loss (dB)
-20
-25
-30
-35
-40
-45
-50
10
2
J1-J2 Input Return Loss
15
20
25
Freq. (GHz)
35
30
40
45
50
Freq. (GHz)
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4BN1840-2
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
Typical RF Performance at T
A
= +25°C
Rev. V3
0
-5
-10
-15
-20
Loss (dB)
J2-J1 Output Return Loss
-25
-30
-35
-40
-45
-50
10
15
20
25
30
Freq. (GHz)
35
40
45
50
0
-5
-10
-15
-20
-25
-30
Loss (dB)
-35
-40
-45
-50
-55
-60
-65
-70
10
15
RF-DC Isolation
20
25
30
Freq. (GHz)
35
40
45
50
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4BN1840-2
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
MILS
DIM
A
B
C
D
E
F
G
H
RF Bond Pads
J1 & J2
DC Bond Pads
B1 & B2
Chip Thickness
MIN
57.7
68.7
26.5
31.5
15.5
20.5
4.4
4.4
MAX
58.9
69.9
27.5
32.5
16.5
21.5
5.6
5.6
Rev. V3
MILLIMETERS
MIN
1.47
1.75
0.67
0.80
0.38
0.52
0.13
0.11
.150 X .130
.220 X .120
0.125
MAX
1.78
1.08
0.70
0.83
0.41
0.55
0.16
0.14
REF.
REF.
REF.
5.9 X 5.1 REF.
8.7 X 4.7 REF.
0.005
REF.
Note:
Yellow areas are gold bond pads
Assembly Considerations
Cleanliness
These chips should be handled in a clean environment.
Electro-Static Sensitivity
The MA4BN1840-2 bias network is ESD, Class 1B sensitive. The proper ESD handling procedures should be
used.
Wire Bonding
Thermosonic wedge wire bonding using 0.003” x 0.00025” ribbon or ball bonding with 0.001” diameter gold wire is
recommended. A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy
should be adjusted to the minimum required. RF bonds should be as short as possible for best performance.
Mounting
These chips have Ti-Pt-Au topside and backside metal. They can be die mounted with either a gold-tin eutectic
solder preform , RoHS compliant solders or electrically conductive silver epoxy. Mounting surface must be clean
of organic contaminants and flat for best adhesion results.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and a tool tip
temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The chip should not be
exposed to temperatures greater than 320°C for more than 20 seconds. No more than three seconds should be
required for attachment.
Electrically Conductive Epoxy Die Attachment
Assembly should be preheated to 125-150°C. A minimum amount of epoxy should be used, approximately 1 to 2
mils thickness for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the
perimeter of the chip after placement. Cure epoxy per manufacturer’s time-temperature schedule. Typically 150°C
for 1 hour.
RoHS Soldering
See application note
M538 page 7
on the
M/A-COM website
for the recommended heating profile.
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4BN1840-2
Monolithic HMIC™
Integrated Bias Network
RoHS Compliant
Rev. V3
Operation of the MA4BN1840-2
Broadband operation of the MA4BN1840-2 Bias Network is accomplished by applying D.C. bias to the “ B1 “ and
“B2“ D.C. bias ports on the die. The outputs, J1 and/or J2 provide the D.C. bias to the corresponding, connected,
microwave device(s). The MA4BN1840-2 can be utilized to D.C. bias (2) devices simultaneously in conjunction
with the MA4BN1840-1 which can be used as the D.C. Bias Return. The small D.C. resistance (< 1
Ω)
of the
D.C. Bias Port allows up to +/- 150 mA @ +/- 50 V to be delivered while still maintaining > 35 dB RF to D.C.
isolation.
MA4BN1840-2 Schematic
J1 (IN)
J2 (OUT)
D.C. Ground
B1: D.C. Bias #1
B2: D.C. Bias #2
D.C. Ground
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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