Power Management Circuit, CMOS, PDIP16,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 6 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| BQ2212PN | BQ2212SN | |
|---|---|---|
| Description | Power Management Circuit, CMOS, PDIP16, | Power Management Circuit, CMOS, PDSO16, |
| Is it Rohs certified? | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Encapsulate equivalent code | DIP16,.3 | SOP16,.25 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum supply current (Isup) | 6 mA | 6 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |
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