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BS62UV1027SIP10

Description
Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, SOP-32
Categorystorage    storage   
File Size431KB,10 Pages
ManufacturerBrilliance
Environmental Compliance  
Download Datasheet Parametric View All

BS62UV1027SIP10 Overview

Standard SRAM, 128KX8, 100ns, CMOS, PDSO32, SOP-32

BS62UV1027SIP10 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instructionSOP, SOP32,.56
Reach Compliance Codeunknown
Maximum access time100 ns
Other featuresIT ALSO OPERATES AT 3.0 V NOMINAL SUPPLY VOLTAGE
I/O typeCOMMON
JESD-30 codeR-PDSO-G32
length20.447 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply2/3 V
Certification statusNot Qualified
Maximum seat height2.997 mm
Maximum standby current3e-7 A
Minimum standby current1.2 V
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.9 V
Nominal supply voltage (Vsup)2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.303 mm
Base Number Matches1
BSI
FEATURES
Ultra Low Power/Voltage CMOS SRAM
128K X 8 bit
BS62UV1027
• Data retention supply voltage as low as 1.2V
• Easy expansion with CE2, CE1 and OE options
• Wide Vcc operation voltage :
C-grade : 1.8V ~ 3.6V
I-grade : 1.9V ~ 3.6V
(Vcc_min.=1.65V at 25
o
C)
• Ultra low power consumption :
Vcc = 2.0V C-grade : 7mA (Max.) operating current
I -grade : 8mA (Max.) operating current
0.05uA (Typ.) CMOS standby current
Vcc = 3.0V C-grade : 13mA (Max.) operating current
I- grade : 15mA (Max.) operating current
0.10uA (Typ.) CMOS standby current
• High speed access time :
-85
85ns (Max.)
-10
100ns (Max.)
• Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
DESCRIPTION
The BS62UV1027 is a high performance, ultra low power CMOS
Static Random Access Memory organized as 131,072 words by 8 bits
and operates from a wide range of 1.8V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current of
0.05uA at 2.0V/25
o
C and maximum access time of 85ns at 85
o
C.
Easy memory expansion is provided by an active LOW chip
enable (CE1), an active HIGH chip enable (CE2), and active LOW
output enable (OE) and three-state output drivers.
The BS62UV1027 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS62UV1027 is available in DICE form, JEDEC standard 32 pin
450mil Plastic SOP, 300mil Plastic SOJ, 600mil Plastic DIP, 8mmx13.4
mm STSOP and 8mmx20mm TSOP.
POWER DISSIPATION
STANDBY
Operating
(I
CCSB1
, Max)
Vcc=
Vcc=
3.0V
2.0V
(I
CC
, Max)
Vcc=
Vcc=
3.0V
2.0V
PRODUCT FAMILY
PRODUCT
FAMILY
BS62UV1027SC
BS62UV1027TC
BS62UV1027JC
BS62UV1027STC
BS62UV1027PC
BS62UV1027DC
BS62UV1027SI
BS62UV1027TI
BS62UV1027JI
BS62UV1027STI
BS62UV1027PI
BS62UV1027DI
OPERATING
TEMPERATURE
Vcc
RANGE
SPEED
(ns)
C-grade:1.8~3.6V
I-grade:1.9~3.6V
PKG TYPE
SOP-32
TSOP-32
SOJ-32
STSOP -32
PDIP-32
DICE
SOP -32
TSOP-32
SOJ-32
STSOP -32
PDIP- 32
DICE
+0 C to +70 C
O
O
1.8V ~ 3.6V
85/100
1.3uA
0.5uA
13mA
7mA
-40 C to +85 C
O
O
1.9V ~ 3.6V
85/100
2.5uA
1.0uA
15mA
8mA
PIN CONFIGURATIONS
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
BS62UV1027SC
27
BS62UV1027SI
26
BS62UV1027PC
25
BS62UV1027PI
BS62UV1027JC
24
BS62UV1027JI
23
22
21
20
19
18
17
VCC
A15
CE2
WE
A13
A8
A9
A11
OE
A10
CE1
DQ7
DQ6
DQ5
DQ4
DQ3
BLOCK DIAGRAM
A6
A7
A12
A14
A16
A15
A13
A8
A9
A11
Address
Input
Buffer
20
Row
Decoder
1027
Memory Array
1027 x 1027
1027
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
8
Data
Input
Buffer
8
Column I/O
Write Driver
Sense Amp
128
Column Decoder
14
Control
Address Input Buffer
8
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
BS62UV1027TC
BS62UV1027STC
BS62UV1027TI
BS62UV1027STI
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
DQ7
DQ6
DQ5
DQ4
DQ3
GND
DQ2
DQ1
DQ0
A0
A1
A2
A3
Data
Output
Buffer
8
Brilliance Semiconductor, Inc
.
reserves the right to modify document contents without notice.
R0201-BS62UV1027
CE2
CE1
WE
OE
Vdd
Gnd
A5 A4 A3 A2 A1 A0 A10
1
Revision 2.1
Jan.
2004
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