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BCM21551

Description
Telecom Circuit, 1-Func, CMOS, PBGA621, 14 X 14 MM, FBGA-621
CategoryWireless rf/communication    Telecom circuit   
File Size201KB,2 Pages
ManufacturerBroadcom
Download Datasheet Parametric View All

BCM21551 Overview

Telecom Circuit, 1-Func, CMOS, PBGA621, 14 X 14 MM, FBGA-621

BCM21551 Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionBGA,
Contacts621
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B621
Number of functions1
Number of terminals621
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Terminal formBALL
Terminal locationBOTTOM
Base Number Matches1
BCM21551
®
Brief
SUMMARY OF BENEFITS
Enables high-performance, low-cost HSUPA/HSDPA/WCDMA/
EDGE/GPRS handset design.
Enables small, thin design via through integrated multimedia, RF,
Bluetooth, FM and mixed-signal audio.
Low power consumption through utilization of advanced 65-nm
process and on-chip hardware acceleration architecture.
High-performance, 468-MHz ARM11™ processor for superfast
applications computing speed.
Quad-band 2G and multiband 3G for world-wide coverage and
roaming ability.
Advanced echo cancellation with narrowband, and wideband AMR
codecs.
Extended coverage, fewer dropped calls and improved audio quality,
using M-Stream, SAIC, and unique RF design.
Advanced HSDPA DMI equalizer, offering high data throughput in
during mobile and fading conditions.
High-quality audio, video capture, and playback with H.264 HVGA
hardware support.
Fast multimedia and data download using 480-Mbps USBOTG.
SD/MMC, version 4.2, for supporting external T-Flash/SD memory
cards up to 32 GB.
Single-Chip 65-nm HSUPA + RF + BT + FM + Multimedia SoC
FEATURES
General Characteristics
Single-chip, single-die, HSPA System On a Chip (SoC) with integrated
RF, Bluetooth
®
, FM, multimedia acceleration, high-speed USB, full
mixed-signal audio and dual high-performance applications and
communications CPUs
Advanced, release 6-compliant, 7.2 Mbps HSDPA, 5.8 Mbps HSUPA
modem with Class 33 EDGE
Utilizes the low-cost, low-power, 65-nm digital CMOS process
Compact, 14 mm x 14 mm, 621-pin FBGA package for small, low-cost
PCB design
Multimedia Capabilities
Supports 5.0-Mpixel camera sensors with MIPI serial interface
30 fps, H.264, MPEG4, H.263 and WMV9 video @ high-quality
HVGA resolution
H.264 encode and decode for high-quality, efficient memory usage
Dual LCD support; up to 24M colors with MIPI serial interface
64-tone polyphonic ringer
Digital audio mixing with 5-band equalizer
Advanced audio codec support: MP3, AAC, AAC+, eAAC, WMA,
AMR-NB, AMR-WB, WB-AMR+
Extensive Mixed-Signal and Advanced Audio Integration
USBOTG HS (480 Mbps) and FS transceivers
Stereo headset and earpiece amplifiers with stereo line drivers for
external Class D loudspeaker amplifiers.
stereo DACs with greater than 95 dB SNR
analog TV-out support (Composite)
2G and 3G RF transceiver
Bluetooth 2.1 EDR, FM Rx (RDS) and FM Tx
Advanced Technology
Self-calibrating 2G and 3G transceivers automatically adjusts to
changing conditions and compensates for manufacturing deviations
Broadcom
®
M-Stream technology delivering up to 3 dB better signal
quality
APPLICATIONS
3G HSPA feature phones
3G OpenOS Smartphones
Typical System Block Diagram
Main Speaker/
Speakerphone
SD
MMC
TFlash
Memory
Stick™
USIM
Cam 1
5.0 Mpix
Cam 2
30 fps
LCD 1
LCD 2
Keypad
USBOTG
Dual Mic.
Stereo
Headset
TV
Out
PA/FEM
DDR/SDRAM
NOR/NAND
Charger
Battery
BCM21551
HSUPA
BT/FM
BCM59055
PMU
Vibrator
Backlight
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