BCW144-0729-12AA95L datasheet, PDF

Datasheet> All Categories > The connector> socket> BCW144-0729-12AA95L

BCW144-0729-12AA95L: DescriptionIC Socket, BGA144, 144 Contact(s), ROHS COMPLIANT; CategoryThe connector socket; File Size1MB，8 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

Download Datasheet Parametric View All

BCW144-0729-12AA95L Overview

IC Socket, BGA144, 144 Contact(s), ROHS COMPLIANT

BCW144-0729-12AA95L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Contact to complete cooperation	GOLD/TIN
Contact completed and terminated	GOLD/TIN
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	BGA144
Shell material	CERAMIC
JESD-609 code	e4/e3
Number of contacts	144
Base Number Matches	1

Preview

Download Datasheet

View All

Socket Mounting Recommendations and Reflow Profile

Purpose

This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)

sockets to the printed circuit board (PCB). The recommendations described here are guidelines

only, and modifications may be needed for your particular socket, PCB, and process.

Application

The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist

Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-

pin technology. This technology allows the pins to be soldered to the PCB while still providing

compliance to the device under test (DUT) via springs located at the other end of the pin. The

pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the

sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or

any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating

Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder

paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil

is required. Once the paste has been applied, a standard reflow process is then used to solder the

socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,

the system is then ready to be used.

Locating Pegs

Although designed to mount to the same footprint as the IC, with just a small amount of

additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are

typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.

These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s

pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs

to be soldered to the PCB for better mechanical stability during everyday use and handling of the

socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-

pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints

may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M

Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is

required to ensure mechanical and electrical integrity. Recommended stencil dimensions are

given in the next section of this document.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 ·

www.e-tec.com

info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Recommended Resources

Automatic power shut-off circuit

5V/12V converter circuit

Multifunctional power socket circuit

Practical automatic timer circuit diagram

Test probe circuit

AC zero-crossing detection circuit

2010 Xilinx FPGA Latest Course Large-scale Technical Seminar: On the morning of December 3, Aniu went to Beijing Rongjin International Hotel to attend the 2010 Xilinx FPGA latest course large-scale technical seminar. At nine o'clock, the whole venue was bustling...; jameswangsynnex FPGA/CPLD

LCD clock display based on ds12c887: LCD clock display based on ds12c887, 1602 liquid crystal display....; zhaozhi0810 MCU

How to monitor WinCE memory usage on PC?: The background of this question is: Our company is engaged in car navigation, using WinCE platform. Last week, a boss in our department asked me to make a tool for real-time monitoring of WinCE memory...; jxzg101 Embedded System

There is a problem with the output level maintenance of GD32 pins after PWM output stops. Friends who are familiar with GD32, please come and have a look!: I use the GD32F103Cxx microcontroller. I turned on the PWM function provided by the microcontroller. After initialization, the output can be output normally, but there is a problem that cannot be solv...; bigbat GD32 MCU

Can any expert help me with the I2C problem of 430F149? Waiting online...: I just got in touch with MSP430 microcontrollers and don't know much about 430. I bought the MSP430F149 development board. I want to write an experiment to control digital sensors using the I2C bus, b...; 电信骄子 Microcontroller MCU

Calculation of voltage and current lead and lag of capacitors and inductors, and network reactance: Calculation of the lead and lag of the voltage and current of capacitors and inductors, and network reactance1. The waveform can show the lead and lag, but it cannot be seen that it is 90° ahead! How ...; QWE4562009 Integrated technical exchanges

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components