BUW49-0728-07CB95 datasheet, PDF

Datasheet> All Categories > The connector> socket> BUW49-0728-07CB95

BUW49-0728-07CB95: DescriptionIC Socket, BGA49, 49 Contact(s), ROHS COMPLIANT; CategoryThe connector socket; File Size1MB，8 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

Download Datasheet Parametric View All

BUW49-0728-07CB95 Overview

IC Socket, BGA49, 49 Contact(s), ROHS COMPLIANT

BUW49-0728-07CB95 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Contact to complete cooperation	GOLD/TIN
Contact completed and terminated	GOLD/TIN
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	BGA49
JESD-609 code	e4/e3
Manufacturer's serial number	BUW
Number of contacts	49
Base Number Matches	1

Preview

Download Datasheet

View All

Socket Mounting Recommendations and Reflow Profile

Purpose

This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)

sockets to the printed circuit board (PCB). The recommendations described here are guidelines

only, and modifications may be needed for your particular socket, PCB, and process.

Application

The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist

Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-

pin technology. This technology allows the pins to be soldered to the PCB while still providing

compliance to the device under test (DUT) via springs located at the other end of the pin. The

pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the

sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or

any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating

Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder

paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil

is required. Once the paste has been applied, a standard reflow process is then used to solder the

socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,

the system is then ready to be used.

Locating Pegs

Although designed to mount to the same footprint as the IC, with just a small amount of

additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are

typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.

These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s

pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs

to be soldered to the PCB for better mechanical stability during everyday use and handling of the

socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-

pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints

may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M

Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is

required to ensure mechanical and electrical integrity. Recommended stencil dimensions are

given in the next section of this document.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 ·

www.e-tec.com

info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Recommended Resources

Op Amp and Analog Switching Rohn Compensator

Photodiode light control typical circuit

High quality electronic ballast circuit

Monostable circuit composed of LM324

MSM6822 application circuit diagram

MP3 hardware circuit schematic diagram 10

MaxplusII (Chinese) Quick Start: MaxplusII (Chinese) Quick Start...; songbo FPGA/CPLD

The basic principles and characteristics of crystal oscillators: The crystal oscillator generally adopts the capacitor three-terminal ( Colpitts ) AC equivalent oscillation circuit as shown in Figure 1a ; the actual crystal oscillator AC equivalent circuit is shown...; 鬼谷清泉 Analog electronics

Wide voltage input high voltage DC step-down chip module (high voltage step-down chip module): At present, DC-DC converters with wide voltage input and high voltage input are not common and difficult to find. Here are some recommended models for reference during design: Wide voltage input high ...; power360 Power technology

WINCE5 is based on MFC. When using GDI+, it can be compiled, but it cannot be drawn.: WINCE5 EVC is based on MFC. When using GDI+, it can be compiled, but it cannot draw. I downloaded the header file and LIB library of VC using GDI+ from this website http://www.ernzo.com/LibGdiplus.asp...; sunnyllyy Embedded System

Why LED display screens are widely used? My summary is as follows:: 1. Scalability: The larger the LCD screen is, the higher the investment in production line equipment is. It is very easy to increase the size of the LED display, just like building blocks. The resolut...; 探路者 LED Zone

Why are there 2 extra bytes after downloading the AT89s52 program?: In the programming environment, the space occupied is displayed after compilation. Why is it that after downloading the program into AT89s52, the space occupied by the flash in the download software p...; oyueyueniao 51mcu

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components