0.50
9.52
0.75
3
4x
Socket
Material: TG 200
Thickness: 5.00 mm
484 contacts
Chip 23.00
Pitch 1
2.90
DETAIL X
SCALE 5 : 1
2.90
9.52
Recommended PCB layout
for BGA socket
PCB holes for locating pegs
- ø1.10±0.02
PCB pad diameter
-minimum ø0.60
1.60
0.80
3.10
0.90
1
5
"Corner A1"
21
27.55
31.75
Retention frame
Material: Epoxy FR4
Thickness: 2.50mm
E tec E-tec
US.EP.CN.TW.JP.KR Patent
US.EP.CN.TW.JP.KR Patent
E tec E-tec
US.EP.CN.TW.JP.KR Patent
E tec E-tec
US.EP.CN.TW.JP.KR Patent
15
27.55
33.75
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS
SURFACE FINISH:
GENERAL TOLERANCES: ±0.10
LINEAR:
ANGULAR:
4
2.2
E tec E-tec
4
0.80
4x
0
1.6
Remark:
X
ng
ati
loc
al
on
pti
"O
2x
1
g"
pe
2.50
"top view drawing"
Modification
DRAWN
CHK'D
APPV'D
MFG
Q.A
Visa
BUA screw Lock socket, 484 pins,
Pitch 1.00mm, matrix 22x22
Retention frame, Basic system 18x18
Date
Drawn by
Date
Name
www.e-tec.com
w/o locating pegs
"E-tec code"
w/o locating pegs
"Production code"
with locating pegs
0
L.G
K.S
29.09.05
29.09.05
L.G
29.09.05
BUW484-1030-22AA01
BUW0484-10-07201-22AAA
A4V
Scale: 2:1
MATERIAL:
.
SHEET 1 OF 1
"E-tec code"
with locating pegs
BUW484-1030-22AA01L
BPW0484-10-07201-22AAAL
0
REVISION
The information contained in this drawing is proprietary to
E-tec and shall not be reproduced or disclosed in whole
or in part or used for any design or manufacture except whe
such user possesses direct, written authorization from E-tec
WEIGHT:
"Production code"
G:\Konstruktion\Dessins Solidworks\Dessins\BGA\BUW\BUW484\BUW0484-10-07201-22AAA\BUW0484-10-07201-22AAA