This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
On-Board Type (DC) EMI Suppression Filters(EMIFILr)
Chip Ferrite Beads Arrays BLA31A/BLA31B Series
3
The miniaturize of electronic equipment requires high
performance EMI filters which enables high density
mounting. BLA31A/B series consists of 4 circuit of
ferrite bead inductor.
BLA31A/B is suitable for EMi suppression in smaller
digital equipment.
0.3±0.2
0.4±0.2
3.2±0.2
0.8±0.1
0.8±0.2
s
Features
1. BLA31A/B have 4 circuits in 3.2x1.6mm body with 0.8mm
pitch.
2. Provides attenuation across a broad frequency range.
Two types of impedance are available which meets
general signal line and high speed signal line.
3. Original inner electrode structure enables extra low
crosstalk.
4. The nickel barrier structure of the extermal
electrodes provides excellent solder heat resistance.
Both flow and reflow soldering methods can employed.
Impedance (at 100MHz)
(ohm)
30
±25%
60
±25%
120
±25%
220
±25%
600
±25%
1000
±25%
120
±25%
220
±25%
470
±25%
600
±25%
1000
±25%
Rated Current
(mA)
200
200
150
150
100
50
150
150
100
100
50
1.6±0.2
in mm
Part Number
BLA31AG300SN4
BLA31AG600SN4
BLA31AG121SN4
BLA31AG221SN4
BLA31AG601SN4
BLA31AG102SN4
BLA31BD121SN4
BLA31BD221SN4
BLA31BD471SN4
BLA31BD601SN4
BLA31BD102SN4
Number of Circuit : 4
DC Resistance(max.)
(ohm)
0.10
0.25
0.30
0.30
0.50
0.70
0.40
0.45
0.55
0.65
0.55
Operating Temperature Range
(°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
s
Equivalent Cirucit
s
Impedance-Frequency (Typical)
BLA31A Series
1200
AG600SN4
AG102SN4
900
Impedance (Ω)
AG601SN4
AG221SN4
AG121SN4
AG300SN4
600
300
There are no polarity.
0
1
10
Frequency (MHz)
100
1000
Continued on the following page.
63
This is the PDF file of catalog No.C31E-6
Continued from the preceding page.
C31E6.pdf 01.5.29
s
Impedance-Frequency Characteristics
BLA31AG300SN4
40
80
BLA31AG600SN4
Z
Z
60
R
Impedance (Ω)
R
Impedance (Ω)
3
30
20
40
X
10
20
X
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
Frequency (MHz)
1000
BLA31AG121SN4
200
300
BLA31AG221SN4
150
Z
Impedance (Ω)
Impedance (Ω)
R
100
225
Z
R
150
50
X
75
X
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
Frequency (MHz)
1000
BLA31AG601SN4
800
1200
BLA31AG102SN4
600
Z
Impedance (Ω)
Impedance (Ω)
R
400
900
Z
R
600
200
X
X
300
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
Frequency (MHz)
1000
s
Impedance-Frequency (Typical)
BLA31B Series
2000
1500
Impedance (Ω)
BD102SN4
1000
BD601SN4
BD471SN4
BD221SN4
BD121SN4
500
0
1
10
Frequency (MHz)
100
1000
64
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
s
Impedance-Frequency Characteristics
BLA31BD121SN4
300
500
BLA31BD221SN4
225
Z
Impedance (Ω)
Impedance (Ω)
R
150
X
75
375
Z
R
250
X
125
3
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
Frequency (MHz)
1000
BLA31BD471SN4
800
1000
BLA31BD601SN4
600
Z
Impedance (Ω)
Impedance (Ω)
R
400
X
750
Z
R
500
X
200
250
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
Frequency (MHz)
1000
BLA31BD102SN4
2000
1500
Impedance (Ω)
Z
1000
R
500
X
0
1
10
100
Frequency (MHz)
1000
65
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLA Series Notice (Soldering and Mounting)
1. Standard Land Pattern Dimensions
3
For Reflow and Flow Soldering
2.8
Land
Solder Resist
2.2-2.6
0.8
0.8Pitch
0.4
• If there are high amount of self-heating on pattern, the
contact point of PCB and part may become damaged.
(in mm)
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
(1) Solder Paste Printing
BLA31Series
Ensure that solder is applied to a minimum height of
0.2mm to 0.3mm at the end surface of the part.
Coat the solder paste a thickness of 100µm to 200µm.
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
(2) Adhesive Application
BLA31Series
Coating amount is illustrated in the following diagram.
Chip Solid Inductor
a:20µm−70µm
b:30µm−35µm
c:50µm−105µm
a
c
PCB
Bonding agent
Land
b
Continued on the following page.
1
66
0.2−0.3mm min
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
BLA Series Notice (Soldering and Mounting)
Continued from the preceding page.
Temperature [°C]
3. Standard Soldering Conditions
(1) SOLDERING METHODS
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
(2) SOLDERING TEMPERATURE AND TIME
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder: H60A H63A solder(JIS Z 3238)
Flux :
Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.)
Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
Do not use water-soluble fulx.
Allowable Flow Soldering Temperature and Time
280
270
260
BLA31
250
240
230
3
0
5
10
15
Time [s]
20
25
30
Allowable Reflow Soldering Temperature and Time
280
270
Temperature [°C]
260
250
BLA31
240
230
0
20
30
40
50
Time [s]
60
70
80
90
(3) SOLDERING CONDITION
Flow Solder
Pre-heating
300
Temperature [°C]
250
200
150
100
50
0
cooling
Soldering Gradualair)
(in
Max. Temp. 250°C
60s Min.
10s Max.
Reflow Solder
Pre-heating
300
Temperature [°C]
250
200
150
100
50
0
20s Max.
60s Min.
60s Max.
230°C
183°C
cooling
Soldering Gradualair)
(in
Max. Temp. 230°C
Continued on the following page.
2
67
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