F-214
™
BEC5–080–02–L–2–V–A
BEC5–100–02–L–2–V–A
(0,50 mm) .0197"
BEC5 SERIES
HIGH DENSITY/HIGH SPEED EDGE CARD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BEC5
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
280 VAC
RoHS Compliant:
Yes
Mates with:
(1,60 mm) .062" and
(2,40 mm) .094" thick cards
Edge Rate
™
contacts
APPLICATION
0,5 mm
• Solder crimps
Lead-free
solder crimps
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,15 mm) .006" max
1,00 mm
(1,00 mm) .03937" x
(1,27 mm) .050" grid
PCB pad layout
(4 rows)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
Weld
Tab
BEC5
POSITIONS
PER ROW
CARD
THICKNESS
PLATING
OPTION
2
V
A
OPTION
TR
ALSO AVAILABLE
(MOQ Required)
• Tin-Lead Solder Charge
• Other platings
• Pin counts
Contact Samtec.
POSITIONS
PER ROW
–080
–090
–100
–02
–080, –090, –100
= (1,60 mm) .062"
thick card
–L
= 10µ" (0,25 µm) Gold on contact area,
Matte Tin on solder tail
–K
= (8,25 mm) .325"
Polyimide film
Pick & Place Pad
–03
= (2,40 mm) .094"
thick card
–S
= 30µ" (0,76 µm) Gold on contact area,
Matte Tin on solder tail
A
(49,00)
1.929
(54,00)
2.126
(59,00)
2.323
B
(44,15)
1.738
(49,15)
1.935
(54,15)
2.132
C
(14,58)
.574
(16,58)
.653
(18,58)
.731
D
(45,70)
1.799
(50,70)
1.996
(55,70)
2.193
E
(46,50)
1.831
(51,50)
2.028
(56,50)
2.224
02
A
C
(0,50) .0197
(9,00)
.354
B
01
02
01
Note:
May not be suitable
for hot plugging application,
contact Samtec engineering.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(0,50)
.0197
(1,00) .03937
D
E
(1,86)
.073
(1,32)
.052
DIA
(13,00)
.512
(1,25)
.049
(1,27)
.050
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Microcontroller MCU
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