REVISION T
DO NOT
SCALE FROM
THIS PRINT
DESIGNED & DIMENSIONED
IN MILLIMETERS[INCHES]
"A" REF
"B" REF
"C" REF
15.76 .621 REF
1.00 .039
REF
BEC5-XXX-XX-X-X-V-A-XX-TR
No OF POSITIONS
-080, -090, -100
(SEE NOTE 6)
CARD THICKNESS
-02 (1.57mm [.062] PCB)
(USE SUB-IM-C-270-02-X-X)
-03 (2.36 mm [0.93] PCB)
(USE SUB-IM-C-270-03-X-X)
9.00 .354
REF
PLATING SPECIFICATION
-L: 10 µ" SELECTIVE GOLD,
MATTE TIN ON TAIL
(USE SUB-IM-C-270-XX-L-X)
-S: 30 µ" SELECTIVE GOLD,
MATTE TIN ON TAILS
(USE SUB-IM-C-270-XX-S-X)
PACKAGING
-TR: TAPE & REEL
OPTIONS
-K: POLYIMIDE FILM
(SEE FIG. 2, SHT 2)
ALIGNMENT PINS
-A: ALIGMENT PINS
VERTICAL
"D"
REF
"A"
'B'
"E" (SEE NOTE 8)
BEC5-XXX-XX-V-XX
"A"
SOLDER COMPOSTION & STYLE
-1: 63% TIN / 37% LEAD CHARGE TAIL
(USE SUB-IM-C-270-XX-X-1)
-2: 96.5% TIN / 3.5% SILVER
LEAD FREE CHARGE TAIL
(USE SUB-IM-C-270-XX-X-2)
0.51 .020
TOL NON-ACCUM
PIN 03(BOTTOM)
PIN 04(TOP)
13.00 .512
REF
PIN 08(TOP)
PIN 07(BOTTOM)
PIN 04
(TOP)
"C"
"C"
PIN 03
(BOTTOM)
1.18 .046
SUB-IM-C-270-XX-X-X
2.43 .096 REF
SEE NOTE 5
1.86 .073
(2 PLCS)
WT-16-06-T
PIN 01(TOP)
PIN 02(BOTTOM)
PIN 06 (BOTTOM)
PIN 05 (TOP)
'D'
"F" (SEE NOTE 9)
DETAIL 'B'
SCALE 4 : 1
NOTES:
1.32 .052
REF
1.000 .039
(TYP) NON ACCUM
1.32 .052
REF
C
L
SECTION "C"-"C"
SCALE 3 : 1
6.00 .236
"F" REF
2.66±0.13 .105±.005
0.64 .025 REF (TYP)
"J"±0.20
"H" REF
1.10 .043 REF
DETAIL 'D'
SCALE 4 : 1
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE: 2.22N[.5 LB].
3. PARTS TO BE PACKAGED IN TAPE AND REEL AS STANDARD
4. FOR QUANTITIES UP TO 49 PIECES, NO LEADER, TRAILER OR REEL WILL BE SUPPLIED
FOR QUANTITIES OF 50-124, NO LEADER OR TRAILER WILL BE SUPPLIED
5. SOLDER CRIMP VOLUME IS .20058 MM³ (0.000012691 IN³)
6. NUMBER OF POSITIONS EQUALS TOTAL NUMBER OF CIRCUITS PER ROW. THIS CONNECTOR USES ONE
BI-LEVEL ROW PER SIDE WITH ELECTRICALLY INDEPENDENT CONTACTS STAGGERED VERTICALLY TO
MAINTAIN A .5 MM PITCH. A -080 PART HAS 80 INDEPENDENT CONTACTS ON EACH SIDE OF THE PART
FOR A TOTAL OF 160 CONTACTS.
7. THESE INSIDE EDGES ARE NOT TO APPEAR IN THE WINDOW WHEN VIEWED FROM DIRECTLY ABOVE.
8. DIMENSION TAKEN BETWEEN TOP AND BOTTOM PINS.
9. CHECK TO THE SIDE OF THE SOLDERTAIL AND NOT THE SOLDER CRIMP.
10. SEE DOCUMENT CO-OP-WI-3001-M FOR ADDITIONAL INSTRUCTION.
11. NOTE DELETED.
12. MEASURE THIS DIMENSION AT ALL 4 CORNERS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
BEC5-080-02-X-X-V-A SHOWN
FIG 1
TOLERANCES ARE:
DECIMALS
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN
MILLIMETERS [INCHES]
ANGLES
X.X: 0.3 [.01]
2
X.XX: 0.13 [.005]
X.XXX: 0.051 [.0020]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
INSULATOR: LCP , COLOR BLACK
CONTACT: BeCu
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
BI-LEVEL EDGE CARD ASSEMBLY
BEC5-XXX-XX-X-X-V-A-XX-TR
SHEET
1
OF
2
BY:
M MURILLO 1/16/2009
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
REVISION T
"A" REF
C
L
"K"±0.50[.020]
SEE NOTE 7
"G"±0.10
2.41 .095
REF
C
L
9.55 .376
REF
0.38±0.50 .015±.020
13.18 .519
7.14 .281
8.25 .325
-K: POLYIMIDE PAD
(USE K-DOT-.325-.450-.005)
(BEC5-080-02-X-X-V-A-K SHOWN)
FIG 2
2.29 .090
REF
0.05
- 0.05
.002
- .002
(SEE NOTE 12)
BEC5-XXX-XX-V-XX
0.15 .006
+0.08
+.003
1.25 .049
WT-16-06-T
SUB-IM-C-270-XX-X-X
1.27 .050 (TYP)
"L"±0.10
SECTION "A"-"A"
SCALE 7 : 1
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
BI-LEVEL EDGE CARD ASSEMBLY
BEC5-XXX-XX-X-X-V-A-XX-TR
SHEET
2
OF
2
BY:
M MURILLO 1/16/2009
F:\DWG\MISC\MKTG\BEC5-XXX-XX-X-X-V-A-XX-TR-MKT.SLDDRW
Embedded System
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