F-215
BDL–110–G–F
BBL–112–T–E
BBD–130–T–B
BHS–125–G–A
(2,54 mm) .100"
BBS–116–G–C
BBS, BBL, BHS, BBD, BDL SERIES
MACHINED BOARD STACKING STRIPS
Mates with:
SS, SD, HSS, SL, SDL,
ESS, ESD
TYPE
STRIP
1
NO. PINS
PER ROW
PLATING
OPTION
LEAD
STYLE
FEATURES
•
Low profile design
achieves (3,89 mm)
.153" board spacings
when mated with SL
Series.
•
Approach the reliability
of a permanent
connection with the
flexibility of a separable
connection.
BBS
= Standard Single Row
(2,54) .100 x No. of Positions
(2,54)
.100
(2,54) .100 TYP
(1,27)
.050
–G
=20 µ" (0,51 µm)
Gold
BBL
= Low Profile Single Row
(2,54)
.100
–T
=Tin
BBL body available with
Styles –E & –F only.
BHS
= High Temp Single Row
SPECIFICATIONS
For complete specifications
see www.samtec.com?BBS,
www.samtec.com?BBL,
www.samtec.com?BHS
www.samtec.com?BBD or
www.samtec.com?BDL
Insulator Material:
Black Glass Filled Polyester
(BBS, BBD, BBL)
Black High Temp Nylon
(BDL)
Black Liquid Crystal Polymer
(BHS)
Temperature Range:
-55°C to +125°C
Terminal Material:
Phosphor Bronze or Brass
Plating:
Au or Sn over 50µ" (1,27 µm) Ni
RoHS Compliant:
Yes
Lead-Free Solderable:
Wave only
(BBS, BBD, BBL, BDL)
Wave, or reflow with
all Au (BHS)
BBS
BHS
BBL
(2,54) .100 x No. of Positions
BBD
= Standard Double Row
(5,08)
.200
(2,54) .100 TYP
(2,54)
.100
(1,27)
.050
01 thru 32
= BBS & BBL
BDL
= Low Profile Double Row
(2,54)
.100
01 thru 36
BDL body available with
Styles –E & –F only.
= BBD, BDL & BHS
BBD
BDL
–A
Z = (5,33 mm) .210"
–B
Z = (8,51 mm) .335"
–C
Z = (14,86 mm) .585"
–E
Z = (1,78 mm) .070"
–F
Z = (2,16 mm) .085"
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
(3,18)
.125
(0,46)
.018
DIA
(1,27)
.050
Style E:
(2,74)
.108
Style F:
(3,18)
.125
(0,46)
.018 DIA
Z
(1,78)
.070 DIA
Z
(1,78)
.070
DIA
(1,27)
.050 DIA
(0,46)
.018
DIA
(0,46)
.018 DIA
(3,18)
.125
BBL
Series
(3,18)
.125
Z
BBD
Series
BDL
Series
BBS and BHS
Series
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
Embedded System
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