SRAM Module, 128KX8, 30ns, CMOS
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| Maximum access time | 30 ns |
| I/O type | COMMON |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of terminals | 30 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIP30,.2 |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.016 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.23 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal pitch | 2.54 mm |
| Terminal location | SINGLE |
| Base Number Matches | 1 |
| M1422LPS-30C | M1422LPS-55C | M1422LPS-35C | M1422PS-55C | M1422PS-35C | M1422LPS-45C | M1422PS-30C | M1422PS-45C | |
|---|---|---|---|---|---|---|---|---|
| Description | SRAM Module, 128KX8, 30ns, CMOS | SRAM Module, 128KX8, 55ns, CMOS | SRAM Module, 128KX8, 35ns, CMOS | SRAM Module, 128KX8, 55ns, CMOS | SRAM Module, 128KX8, 35ns, CMOS | SRAM Module, 128KX8, 45ns, CMOS | SRAM Module, 128KX8, 30ns, CMOS | SRAM Module, 128KX8, 45ns, CMOS |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Maximum access time | 30 ns | 55 ns | 35 ns | 55 ns | 35 ns | 45 ns | 30 ns | 45 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Encapsulate equivalent code | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIP30,.2 |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.016 A | 0.016 A | 0.016 A | 0.08 A | 0.08 A | 0.016 A | 0.08 A | 0.08 A |
| Minimum standby current | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |