Storage Temperature Range ................................-65°C to +150°C
Lead Temperature (soldering, 10s)....................................+300°C
Soldering Temperature (reflow)..........................................+260°C
AVDD to AGND.........................................................-0.3V to +6V
DVDD to DGND........................................................-0.3V to +6V
AGND to DGND.....................................................-0.3V to +0.3V
CH0–CH7, I.C. to AGND (MAX1304/MAX1305/MAX1306)........±6V
CH0–CH7, I.C. to AGND (MAX1308/MAX1309/MAX1310)...±16.5V
CH0–CH7, I.C. to AGND (MAX1312/MAX1313/MAX1314)..±16.5V
D0–D11 to DGND..................................-0.3V to (V
DVDD
+ 0.3V)
EOC, EOLC, RD, WR, CS
to DGND......-0.3V to (V
DVDD
+ 0.3V)
CONVST, CLK, SHDN,
CHSHDN
to DGND -0.3V to (V
DVDD
+ 0.3V)
INTCLK/EXTCLK to AGND .....................-0.3V to (V
AVDD
+ 0.3V)
REF
MS
, REF, MSV to AGND ...................-0.3V to (V
AVDD
+ 0.3V)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
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Microcontroller MCU
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