Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 2:
Junction temperature T
J
= T
C
+ (θ
JC
x V
CC
x I
CC
). This formula can only be used if the component is soldered down to a print-
ed circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150°C.
Note 3:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Note 4:
Junction temperature T
J
= T
A
+ (θ
JA
x V
CC
x I
CC
), assuming there is no heat removal from the exposed pad. The junction
temperature must not exceed 150°C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuits,
V
REF
= 2.475V to 2.525V, V
CC1
= 3.13V to 3.47V, V
CC2
= 4.5V to 5.25V, T
A
= 0°C to +70°C, V
GND
= 0V,
NP = 0, PD = 0, no RF signals applied. Typical values are at V
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