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CY7C1414AV18-167BZI

Description
1MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Categorystorage    storage   
File Size2MB,28 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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CY7C1414AV18-167BZI Overview

1MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C1414AV18-167BZI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instruction15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts165
Reach Compliance Codeunknown
Maximum access time0.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length17 mm
memory density37748736 bit
Memory IC TypeQDR SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)220
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
Base Number Matches1
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CY7C1414AV18-167BZI Related Products

CY7C1414AV18-167BZI CY7C1412AV18-167BZXI CY7C1414AV18-200BZI CY7C1412AV18-200BZXC CY7C1412AV18-250BZXC
Description 1MX36 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 2MX18 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 1MX36 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 2MX18 QDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Is it lead-free? Contains lead Lead free Contains lead Lead free Lead free
Is it Rohs certified? incompatible conform to incompatible conform to conform to
Parts packaging code BGA BGA BGA BGA BGA
package instruction 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
Contacts 165 165 165 165 165
Reach Compliance Code unknown unknown unknown unknown unknown
Maximum access time 0.5 ns 0.5 ns 0.45 ns 0.45 ns 0.45 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609 code e0 e1 e0 e1 e1
length 17 mm 17 mm 17 mm 17 mm 17 mm
memory density 37748736 bit 37748736 bit 37748736 bit 37748736 bit 37748736 bit
Memory IC Type QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM
memory width 36 18 36 18 18
Humidity sensitivity level 3 3 3 3 3
Number of functions 1 1 1 1 1
Number of terminals 165 165 165 165 165
word count 1048576 words 2097152 words 1048576 words 2097152 words 2097152 words
character code 1000000 2000000 1000000 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 70 °C 70 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -
organize 1MX36 2MX18 1MX36 2MX18 2MX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 220 260 220 260 260
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN SILVER COPPER TIN LEAD TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 20 NOT SPECIFIED 20 20
width 15 mm 15 mm 15 mm 15 mm 15 mm
Base Number Matches 1 1 1 - -

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