CYD02S36V-133BBC datasheet, PDF

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CYD02S36V-133BBC: Description64KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256; Categorystorage storage; File Size1MB，29 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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CYD02S36V-133BBC Overview

64KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256

CYD02S36V-133BBC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
Contacts	256
Reach Compliance Code	unknown
Maximum access time	4.4 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B256
JESD-609 code	e0
length	17 mm
memory density	2359296 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Humidity sensitivity level	1
Number of functions	1
Number of terminals	256
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
Certification status	COMMERCIAL
Maximum seat height	1.7 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	17 mm
Base Number Matches	1

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CYD02S36V-133BBC Related Products

	CYD02S36V-133BBC	CYD18S36V-100BBI	CYD02S36V-133BBI	CYD09S36V-133BBC	CYD18S36V-100BBC	CYD02S36V-167BBC	CYD09S36V-167BBC
Description	64KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	512KX36 DUAL-PORT SRAM, 5.2ns, PBGA256, 23 X 23 MM, 1.70 MM HEIGHT, 1 MM PITCH, MO-192, FBGA-256	64KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	256KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	512KX36 DUAL-PORT SRAM, 5.2ns, PBGA256, 23 X 23 MM, 1.70 MM HEIGHT, 1 MM PITCH, MO-192, FBGA-256	64KX36 DUAL-PORT SRAM, 4.4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	256KX36 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	23 X 23 MM, 1.70 MM HEIGHT, 1 MM PITCH, MO-192, FBGA-256	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	23 X 23 MM, 1.70 MM HEIGHT, 1 MM PITCH, MO-192, FBGA-256	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256	17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
Contacts	256	256	256	256	256	256	256
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	4.4 ns	5.2 ns	4.4 ns	4.4 ns	5.2 ns	4.4 ns	4 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
length	17 mm	23 mm	17 mm	17 mm	23 mm	17 mm	17 mm
memory density	2359296 bit	18874368 bit	2359296 bit	9437184 bit	18874368 bit	2359296 bit	9437184 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	36	36	36	36	36	36	36
Number of functions	1	1	1	1	1	1	1
Number of terminals	256	256	256	256	256	256	256
word count	65536 words	524288 words	65536 words	262144 words	524288 words	65536 words	262144 words
character code	64000	512000	64000	256000	512000	64000	256000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C
organize	64KX36	512KX36	64KX36	256KX36	512KX36	64KX36	256KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	NOT SPECIFIED	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	17 mm	23 mm	17 mm	17 mm	23 mm	17 mm	17 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible
JESD-609 code	e0	e0	e0	e0	e0	-	e0
Humidity sensitivity level	1	1	1	1	1	-	1
Peak Reflow Temperature (Celsius)	225	225	225	225	225	-	225
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
Maker	-	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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