CY7C1314CV18-200BZI datasheet, PDF

Datasheet> All Categories > storage> storage> CY7C1314CV18-200BZI

CY7C1314CV18-200BZI: Description512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165; Categorystorage storage; File Size1MB，26 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

Download Datasheet Parametric Compare View All

CY7C1314CV18-200BZI Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	CY7C1314CV18-200BZI	-	-	View	Buy Now

CY7C1314CV18-200BZI Overview

512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C1314CV18-200BZI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts	165
Reach Compliance Code	unknown
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	18874368 bit
Memory IC Type	QDR SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	220
Certification status	COMMERCIAL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm
Base Number Matches	1

Preview

Download Datasheet

View All

D ts e t

aa h e

R c e t r lc r nc

o h se Ee to is

Ma u a t r dCo o e t

n fc u e

mp n n s

R c e tr b a d d c mp n ns ae

o h se rn e

o oet r

ma ua trd u ig ete dewaes

n fcue sn i r i/ fr

p rh s d f m te oiia s p l r

uc a e r

o h r n l u pi s

o R c e tr waes rce td f m

r o h se

fr e rae r

te oiia I. Al rce t n ae

r nl P

l e rai s r

d n wi tea p o a o teOC

o e t h p rv l f h

P r aetse u igoiia fcoy

at r e td sn r n la tr

ts p o rmso R c e tr e eo e

e t rga

r o h se d v lp d

ts s lt n t g aa te p o u t

e t oui s o u rne

rd c

me t o e c e teOC d t s e t

es r x e d h

M aa h e.

Qu l yOv riw

e ve

• IO- 0 1

S 90

•A 92 cr ct n

S 1 0 et ai

• Qu l e Ma ua trr Ls (

ai d

n fcues it QML MI- R -

) LP F

385

•C a sQ Mitr

lay

•C a sVS a eL v l

p c ee

• Qu l e S p l r Ls o D sr uos( L )

ai d u pi s it f it b tr QS D

•R c e trsacic l u pir oD A a d

o h se i

r ia s p l t L n

me t aln u t a dD A sa d r s

es lid sr n L tn ad .

R c e tr lcrnc , L i c mmi e t

o h se Ee t is L C s o

tdo

s p ligp o u t ta s t f c so r x e t-

u pyn rd cs h t ai y u tme e p ca

t n fr u lya daee u loto eoiial

i s o q ai n r q a t h s r n l

s p l db id sr ma ua trr.

u pi

e yn ut

y n fcues

T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e

h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c

a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n

n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -

isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -

c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a

t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g

i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu

r xmu ai s

ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig

y e a e n rd c c aa tr t , e in smuai , r a l e t .

z o

0 3 ohs E cr i , L . lRg s eevd 7 1 0 3

e e oc

T l r m r, l s v iw wrcl . m

o e n oe p ae it w . e c o

o ec

CY7C1314CV18-200BZI Related Products

	CY7C1314CV18-200BZI	CY7C1314CV18-167BZC	CY7C1312CV18-250BZI	CY7C1312CV18-250BZXC	CY7C1312CV18-250BZC	CY7C1312CV18-167BZC	CY7C1312CV18-167BZI	CY7C1312CV18-200BZC	CY7C1314CV18-200BZC	CY7C1314CV18-250BZC
Description	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Is it lead-free?	Contains lead	Contains lead	Contains lead	Lead free	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts	165	165	165	165	165	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	0.45 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
JESD-609 code	e0	e0	e0	e1	e0	e0	e0	e0	e0	e0
length	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM
memory width	36	36	18	18	18	18	18	18	36	36
Humidity sensitivity level	3	3	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	165	165	165	165	165	165	165	165	165	165
word count	524288 words	524288 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	524288 words	524288 words
character code	512000	512000	1000000	1000000	1000000	1000000	1000000	1000000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C
organize	512KX36	512KX36	1MX18	1MX18	1MX18	1MX18	1MX18	1MX18	512KX36	512KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	220	220	220	260	220	220	220	220	220	220
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
Base Number Matches	1	1	1	1	1	1	1	1	1	-

Recommended Resources

Radio power automatic shut-off circuit

Thyristor switch-on delay circuit 3

The main circuit starts the control circuit in sequence

Dual output DC-DC converter

Battery driven pressure gauge circuit

clock pulse coupling circuit

LM5117 cannot carry load: [color=#333333][font=微软雅黑][size=4]How to solve the problem of LM5117 not being able to carry load[/size][/font][/color]...; dsffsd Electronics Design Contest

51 MCU disassembly software recommendation: I recently saw a program that was compiled in reverse order. I used several disassembly software on the Internet, but I felt that the disassembly was not quite correct. I wonder if you experts can rec...; ivysboy 51mcu

Looking for Chinese information on each module of msp4304619: urgent!!!!...; merlong Microcontroller MCU

What size font does viso correspond to?: The font size in Visio2003 is in pt, and its correspondence with the font size in Word is as follows: Number Font Size 1 Extra Large 63 2 Extra 54 3 Primary 42 4 Small Primary 36 5 Large 1st 31.5 6 No...; forisigang Download Centre

The bpdu packet cannot be received in the Fec.c receiving function of the Linux kernel. What's going on?: I sent a bpdu packet (multicast packet), but why can't it be received in the receiving function of Fec? But the broadcast packet and the packet of the target Mac as the board's Mac can be received. Wh...; hlyft Linux and Android

Make an electric shock plate to kill cockroaches (stove pockmarks): I would like to make an explanation about this circuit: The main circuit is the transformer T and its distributed capacitors. The working principle diagram can be found at http://photo.163.com/photos/...; 耗子 Embedded System

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components