The CPC7557N is an integrated diode bridge built on
IXYS Integrated Circuits Division’s High Voltage SOI
technology.
Features
•
Monolithic Construction
•
Surface Mount Package
Ordering Information
Part
CPC7557N
Applications
•
Telecommunications Protection Clamp
•
High Voltage Multiplexer/Switch
Description
8-Pin SOIC in Tubes (100/Tube)
CPC7557NTR 8-Pin SOIC Tape & Reel (2000/Reel)
Pb
e
3
CPC7557N Diagram
A/B
+
B/A
-
DS-CPC7557-R04
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1 Specifications
1.1 Package Pinout
1.2 Pin Description
8
B
N/C
N/C
A
4
5
CPC7557
-
N/C
N/C
1
Pin#
1
2
3
4
5
6
7
8
Name
N/C
N/C
+
A
N/C
N/C
B
Description
Negative Bridge Output
No Connection
No Connection
Positive Bridge Output
Input A
No Connection
No Connection
Input B
+
1.3 Absolute Maximum Ratings
Unless Otherwise Specified all electrical ratings are at 25C
Parameter
Reverse Voltage
Diode Forward Current (Average)
Diode Forward Surge Current
Fusing Current
ESD, Human Body Model
Junction Temperature
1
Storage Temperature
1
Symbol
V
RRM
I
F
I
FSM
Minimum
-
-
-
-
-
-
-65
Maximum
120
250
2
0.02
3
+150
+150
Units
V
mA
rms
A
A
2
s
kV
C
C
I
2
t
-
T
J
T
STG
Derate package for P
DISS
120C/W.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
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1.4 Recommended Operating Conditions
Parameter
Diode Forward Current (Average)
Reverse Voltage
Operating Temperature Range
Thermal Impedance
Symbol
I
F
V
R
T
A
JA
Minimum
-
-
-40
120
Maximum
240
100
+125
-
Units
mA
rms
V
C
C/W
CPC7557
1.5 General Conditions
Typical values are characteristic of the device at 25C
and are the result of engineering evaluations. They are
provided for information purposes only and are not
part of the manufacturing testing requirements.
Unless otherwise noted, all electrical specifications
are listed for T
A
=25C.
1.6 DC Electrical Characteristics
Parameter
Forward Current
Diode Forward Voltage Drop
Reverse Voltage Leakage Current
Conditions
-
I
F
= 40mA
I
F
= 250mA
V
R
=100V
Symbol
I
F
V
F
I
R
Minimum
-
0.83
1
-
Typical
-
0.91
1.3
-
Maximum
240
0.97
1.49
1
Units
mA
rms
V
A
1.7 AC Electrical Characteristics
Parameter
Input Zero Bias Capacitance
Output Zero Bias Capacitance
Bridge Zero Bias Capacitance
Conditions
V
+
V
= 0V
Measured from V
A
to V
B
V
A
= V
B
Measured from V
+
to V
V
+
V
= 0V Measured from
V
A
to V
+/-
and V
B
to V
+/-
Symbol
C
AB
C
+/
C
A/+
, C
A/
,
C
B/+
, C
B/
Minimum
-
-
-
Typical
4.4
8.3
8.5
Maximum
12
20
12
Units
pF
pF
pF
2 Typical Performance Data
Bridge Forward Voltage (V
F
)
vs. Temperature
2.8
Diode Forward Voltage (V)
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=40mA
Diode Forward Voltage (V)
I
F
=250mA
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=40mA
Diode Forward Voltage (V
F
)
vs. Temperature
I
F
=250mA
Reverse Breakdown Voltage (V)
Diode Reverse Breakdown Voltage (V
RRM
)
vs. Temperature
152
150
148
146
144
142
140
138
-40
-20
0
20
40
60
Temperature (ºC)
80
100
3
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3 Manufacturing Information
3.1 Moisture Sensitivity
CPC7557
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC7557N
Moisture Sensitivity Level (MSL) Rating
MSL 1
3.2 ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC7557N
Maximum Temperature x Time
260C for 30 seconds
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Pb
e
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3.5 8-Pin SOIC Package Dimensions
Pin
8
1.270 REF
(0.050)
CPC7557
PCB Land Pattern
0.60
(0.024)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
1.55
(0.061)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
5.40
(0.213)
1.27
(0.050)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
Dimensions
mm
(inches)
0.559 ± 0.254
(0.022 ± 0.010)
3.6 Tape & Reel Dimensions
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=12.00
(0.472)
B
0
=5.30
(0.209)
K
0
= 2.10
(0.083)
A
0
=6.50
(0.256)
P=8.00
(0.315)
Dimensions
mm
(inches)
Embossed Carrier
User Direction of Feed
Embossment
NOTE:
Tape dimensions not shown comply
with
JEDEC Standard EIA-481-2
For additional information please visit
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IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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