MOTOROLA
Designer's
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MBRB20100CT/D
™
Data Sheet
SWITCHMODE
™
Power
D2PAK Surface Mount Power Package
Rectifier
MBRB20100CT
Motorola Preferred Device
The D2PAK Power Rectifier employs the use of the Schottky Barrier principle
with a platinum barrier metal. These state–of–the–art devices have the
following features:
•
Package Designed for Power Surface Mount Applications
•
Center–Tap Configuration
•
Guardring for Stress Protection
•
Low Forward Voltage
•
150°C Operating Junction Temperature
•
Epoxy Meets UL94, VO at 1/8″
•
Guaranteed Reverse Avalanche
•
Short Heat Sink Tab Manufactured — Not Sheared!
1
•
Similar in Size to Industry Standard TO–220 Package
Mechanical Characteristics
3
•
Case: Epoxy, Molded
•
Weight: 1.7 grams (approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
•
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•
Shipped 50 units per plastic tube
•
Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4”
suffix to the part number
•
Marking: B20100T
MAXIMUM RATINGS, PER LEG
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated VR) TC = 110°C
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 100°C
Non-repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0
µs,
1.0 kHz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
Total Device
IFRM
IFSM
IRRM
Tstg
TJ
dv/dt
Symbol
VRRM
VRWM
VR
IF(AV)
Value
100
Unit
Volts
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
100 VOLTS
4
4
1
3
CASE 418B–02
D2PAK
10
20
20
150
0.5
– 65 to +175
– 65 to +150
10000
Amps
Amps
Amps
Amp
°C
°C
V/µs
THERMAL CHARACTERISTICS, PER LEG
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
(1) See Chapter 7 for mounting conditions
Designer’s Data for “Worst Case” Conditions
— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
R
θJC
R
θJA
2.0
50
°C/W
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred
devices are Motorola recommended choices for future use and best overall value.
Rev 1
©
Rectifier
Inc. 1996
Data
Motorola,
Device
1
MBRB20100CT
ELECTRICAL CHARACTERISTICS, PER LEG
Rating
Maximum Instantaneous Forward Voltage (2)
(iF = 10 Amp, TC = 125°C)
(iF = 10 Amp, TC = 25°C)
(iF = 20 Amp, TC = 125°C)
(iF = 20 Amp, TC = 25°C)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
Symbol
vF
Value
0.75
0.85
0.85
0.95
6.0
0.1
Unit
Volts
Maximum Instantaneous Reverse Current (2)
iR
mA
(2) Pulse Test: Pulse Width = 300
µs,
Duty Cycle
≤
2.0%.
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
50
I R, REVERSE CURRENT (mA)
20
10
5
3
TJ = 25°C
150°C
10
TJ = 125°C
TJ = 100°C
1
175°C
100°C
TJ = 150°C
0.1
1
0.5
0
0.1
0.2
0.3
0.4
0.5 0.6
0.7
0.8
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
1
0.01
0
20
TJ = 25°C
40
60
80
100
VR, REVERSE VOLTAGE (VOLTS)
120
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
I F(AV), AVERAGE FORWARD CURRENT (AMPS)
32
28
24
20
16
12
8
4
0
80
90
100
110
120
130
140
TC, CASE TEMPERATURE (°C)
150
160
SQUARE
WAVE
R
θJC
= 2°C/W
RATED VOLTAGE
APPLIED
20
18
AVERAGE POWER (WATTS)
16
14
12
10
8
6
IPK/IAV = 20
IPK/IAV = 10
TJ = 125°C
IPK/IAV = 5
PI
DC
SQUARE
WAVE
DC
4
2
0
0
2
4
6
8
10
12
14
AVERAGE CURRENT (AMPS)
16
18
20
Figure 3. Typical Current Derating, Case,
Per Leg
Figure 4. Average Power Dissipation and
Average Current
2
Rectifier Device Data
MBRB20100CT
INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
0.74
18.79
0.065
1.651
0.420
10.66
0.07
1.78
0.14
3.56
inches
mm
0.330
8.38
D2PAK POWER DISSIPATION
The power dissipation of the D2PAK is a function of the drain
pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
R
θJA
, the thermal resistance from the device junction to
ambient; and the operating temperature, TA. Using the values
provided on the data sheet for the D2PAK package, PD can be
calculated as follows:
PD =
TJ(max) – TA
R
θJA
The 50°C/W for the D2PAK package assumes the use of the
recommended footprint on a glass epoxy printed circuit board
to achieve a power dissipation of 2.5 watts. There are other
alternatives to achieving higher power dissipation from the
D2PAK package. One is to increase the area of the drain pad.
By increasing the area of the drain pad, the power dissipation
can be increased. Although one can almost double the power
dissipation with this method, one will be giving up area on the
printed circuit board which can defeat the purpose of using
surface mount technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad™. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this case
is 2.5 watts.
PD =
150°C – 25°C
= 2.5 watts
50°C/W
Rectifier Device Data
3
MBRB20100CT
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•
Always preheat the device.
•
The delta temperature between the preheat and soldering
should be 100°C or less.*
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
•
The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
•
When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
•
After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•
Mechanical stress or shock should not be applied during
cooling.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
* Due to shadowing and the inability to set the wave height to
incorporate other surface mount components, the D2PAK is
not recommended for wave soldering.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a figure
for belt speed. Taken together, these control settings make up
a heating “profile” for that particular circuit board. On
machines controlled by a computer, the computer remembers
these profiles from one operating session to the next. Figure
5 shows a typical heating profile for use when soldering the
D2PAK to a printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material being
used. This profile shows temperature versus time. The line on
STEP 1
PREHEAT
ZONE 1
“RAMP”
200°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
160°C
STEP 2
STEP 3
VENT
HEATING
“SOAK” ZONES 2 & 5
“RAMP”
the graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a low density board. The Vitronics SMD310 convection/in-
frared reflow soldering system was used to generate this
profile. The type of solder used was 62/36/2 Tin Lead Silver
with a melting point between 177 –189°C. When this type of
furnace is used for solder reflow work, the circuit boards and
solder joints tend to heat first. The components on the board
are then heated by conduction. The circuit board, because it
has a large surface area, absorbs the thermal energy more
efficiently, then distributes this energy to the components.
Because of this effect, the main body of a component may be
up to 30 degrees cooler than the adjacent solder joints.
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
170°C
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
100°C
140°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile for D2PAK
4
Rectifier Device Data
MBRB20100CT
PACKAGE DIMENSIONS
C
E
B
4
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
MIN
MAX
0.340
0.380
0.380
0.405
0.160
0.190
0.020
0.035
0.045
0.055
0.100 BSC
0.080
0.110
0.018
0.025
0.090
0.110
0.575
0.625
0.045
0.055
MILLIMETERS
MIN
MAX
8.64
9.65
9.65
10.29
4.06
4.83
0.51
0.89
1.14
1.40
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
14.60
15.88
1.14
1.40
A
1
2
3
S
–T–
SEATING
PLANE
K
G
D
3 PL
0.13 (0.005)
H
M
J
DIM
A
B
C
D
E
G
H
J
K
S
V
T
CASE 418B–02
ISSUE B
STYLE 3:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
Rectifier Device Data
5
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