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C1608X7R1H222KT

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0022uF, Surface Mount, 0603, CHIP, ROHS AND REACH COMPLIANT
CategoryPassive components    capacitor   
File Size279KB,2 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Environmental Compliance  
Download Datasheet Parametric View All

C1608X7R1H222KT Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0022uF, Surface Mount, 0603, CHIP, ROHS AND REACH COMPLIANT

C1608X7R1H222KT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.0022 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.8 mm
JESD-609 codee3
length1.6 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, PAPER, 7/13 INCH
positive tolerance10%
Rated (DC) voltage (URdc)50 V
size code0603
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width0.8 mm
Base Number Matches1
C SERIES |
Conductive Epoxy
TDK’s Conductive Epoxy Series is a conductive glue-mounted device
rather than solder-mounted.
In high-temperature environments, the
connectivity reliability is focused on the solder fillet because there are thermal
expansion coefficient differences between the substrate, MLCC, and solder
fillet. A conductive glue-mounted device allows for more “flexibility” during
periods of expansion and contraction because the thermal expansion
differences have been reduced by using a non-solder attachment.
Conductive glue is a common method of mounting components in
applications that demand reliability at high temperatures, particularly in
automotive environments. It's also used in applications that cannot be
subjected to the heat of the solder paste mounting process, such as LCD
panels, organic EL and LED displays, and CCD devices, which are particularly
sensitive to high temperatures.
B
T
L
B
W
L
W
T
B
Body Length
Body Width
Body Height
Terminal Width
Case Code
C1005/0402
C1608/0603
C2012/0805
C3216/1206
C3225/1210
L (mm)
1.00
1.60
2.00
3.20
3.20
W (mm)
0.50
0.80
1.25
1.60
2.50
T (mm)
0.50
0.80
1.25
1.60
2.50
Part Number Description
TEMPERATURE CHARACTERISTICS
RATED VOLTAGE (DC)
PACKAGING STYLE
INTERNAL CODES
C3216
X7R
1E
106
K
T
½½½B
SERIES NAME & DIMENSION CODE
CAPACITANCE TOLERANCE
NOMINAL CAPACITANCE (pF)
Features:
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical/thermal strength when use with conductive glue
AEC Q-200 compliant
RoHS, WEE, and REACH compliant
Standard Termination
3
4
5
AgPdCu Termination
3
4
Applications:
Transmission control
Engine sensor module
Automotive power train
Anti-Lock Breaking System
Application requiring conductive glue mounting method
1
No.
(1)
(2)
(3)
(4)
(5)
NAME
Ceramic Dielectric
Internal Electrode
Termination
2
1
2
MATERIAL
Class 1
Class 2
CaZrO
3
BaTiO
3
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
No.
(1)
(2)
(3)
(4)
NAME
Ceramic Dielectric
Internal Electrode
Termination
MATERIAL
Class 1
Class 2
CaZrO
3
BaTiO
3
Nickel (Ni)
Copper (Cu)
AgPdCu
©TDK Corporation of America – Contents are subject to change without notice.
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