CSD-20Z-2.0G (2.1 GHz)
DIRECTIONAL COUPLERS
REV: 013, 01/25/02
• 2.0 - 2.3 GHz
• HIGH POWER…100 WATTS CW
• LOW LOSS
• LOW VSWR
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX PICO™ Z SERIES DIRECTIONAL COUPLERS
The Multi-Mix
®
CSD-Z series provides directional couplers with low insertion loss, low VSWR, and high
power handling in a small outline. Precise coupling and frequency sensitivity make them ideal for
applications involving power amplifiers, signal distribution and processing.
CSD-Z directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance
that is superior to conventional adhesive bonding techniques.
The CSD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible
with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
•
•
•
•
•
•
Small outline size
High power…100 Watts CW
Cost effective for commercial wireless applications
Operating temperature range –55°C to +85°C.
Available on tape and reel
Can be integrated with other Multi-Mix
®
components in a multi-function module
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
AVAILABLE ON
TAPE & REEL
THE MULTI-MIX
®
PROCESS
Multi-Mix
®
is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded
together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure
with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can
contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through vias to
form a SMD module that requires no additional packaging and is suitable for automated assembly.
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
CSD-20Z-2.0G (2.1 GHz)
GENERAL SPECIFICATIONS
ELEC TR IC AL
FREQUENC Y RANGE
MEAN C OUPLING
INSERTION LOSS
VSWR
FREQUENC Y SENSITIVITY
D IREC TIVITY
MAXIMUM INPUT POWER *
*C W i nput power, tested i n fi xture wi th heat si nk at 25° C
2.0 TO 2.3 GHz
19.0 +/- 1.0 dB
0.2 dB (MAX)
1.3:1 (MAX)
+/- 0.2 dB (MAX)
15 dB (MIN)
100W (MAX)
MEC H AN IC AL
SIZE / OUTLINE
WEIGHT
RF INTERFAC E*
*Refer to layout gui deli nes for recommended RF i nterface.
EN VIR ON MEN TAL
OPERATING TEMPERATURE RANGE
-55
°
To + 85
°
, C
0.18 x 0.18 x 0.07 i nches
0.003 oz.
Surface Mount
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
CSD-20Z-2.0G (2.1 GHz)
PACKAGE OUTLINE
NOTES:
1. ALL DIMENSIONS ARE IN INCHES.
2. TOLERANCES: -3 PLACE DECIMALS; ±.005.
1
1
2
3
4
In
Coupled
Out
Isolated
2
Coupled
In
Isolated
Out
3
Out
Isolated
In
Coupled
4
Isolated
Out
Coupled
In
THE MULTI-MIX MICROTECHNOLOGY
®
GROUP IS ISO-9001 REGISTERED
Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
Embedded System
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