THICK FILM PRECISION CHIP RESISTORS
MILITARY GRADE
RESISTORS CAPACITORS COILS DELAY LINES
MCT SERIES
RoHS
Term.W is
RoHS
compliant
& 260°C
process
compatible
L
t
T
t
Choice of termination materials: 100% tin plated
nickel barrier is standard (palladium silver, gold, or
tin-lead solder is available)
Wraparound termination is standard, single sided
termination is available (Option ‘S’)
Wide resistance range: 0.1Ω to 100MΩ
100% Group A screening per MIL-R-55342 available
Wide design flexibility for use with hybrid or smd circuitry
Custom sizes, high surge, untrimmed chips available
Backside metalization available
W
Wraparound Termination (standard)
Single Face Termination (Opt. S)
Precision performance to 0.1% 50ppm/°C!
RCD series MCT chip resistors are designed to meet
applicable performance requirements of MIL-PRF-55342
1
.
Variety of sizes and termination materials allows wide design
flexibility. Palladium silver terminations are recommended for
use with conductive epoxy, gold is recommended for wire
bonding, and tin plated nickel for soldering.
SPECIFICATIONS
RCD
Type
MCT0402
MCT0505
MCT0603
MCT0805
MCT1005
MCT1206
MCT1505
MCT1210
MCT2010
MCT2512
Wattage
@ 70°C**
50MW
100MW
100MW
150MW
200MW
250MW
250MW
500MW
800MW
1000MW
Voltage
Rating
30V
50V
40V
70V
100V
125V
125V
150V
150V
200V
Resistance
R an g e
10
Ω
- 1M
1Ω - 10M
0.1
Ω
- 100M
0.1
Ω
- 100M
1Ω - 20M
0.1
Ω
- 100M
1Ω - 10M
0.1
Ω
- 100M
0.1
Ω
- 100M
0.1
Ω
- 100M
L*
±.008 [0.2]
.039 [1.0]
.050 [1.27]
.060 [1.53]
.075 [1.91]
.100 [2.54]
.124 [3.15]
.150 [3.81]
.124 [3.15]
.196 [5.0]
.248 [6.3]
W
±.008 [0.2]
.020 [.51]
.050 [1.27]
.030 [.76]
.050 [1.27]
.050 [1.27]
.061 [1.55]
.050 [1.27]
.100 [2.54]
.100 [2.54]
.125 [3.18]
t
2
.012±.005
[.3±.13]
.014±.007
[.35±.18]
.012±.006
[.3±.15]
.016±.008
[.4±.2]
.018±.008
[.45±.2]
.020±.008
[.5±.2]
.020±010
[.5±.25]
.020±.010
[.5±.25]
.020±.010
[.5±.25]
.020±.010
[.5±.25]
T*
.014±.006
[.35±.15]
.018±.006
[.45±.15]
.018±.006
[.45±.15]
.018±.006
[.50±.15]
.020±.006
[.50±.15]
.020±.006
[.50±.15]
.020±.006
[.50±.15]
.020±.006
[.50±.15]
.020±.006
[.50±.15]
.020±.006
[.50±.15]
*
Dimension given is for single face termination. Add .004” [.1mm] for wraparound termination.
**
Wattage based on mounting to ceramic substrate, derate by 25% if mounted to a glass epoxy P.C.B.
1
Military p/n’s are given for reference only and do not imply qualification or exact interchangeability.
2
Dimension “t” (underside termination width) applies only to termination type W
TYPICAL PERFORMANCE CHARACTERISTICS
C haracteri sti c
Temp. C oeffi ci ent
Thermal Shock
Short Ti me Overload
Hi gh Temp. Exposure
Moi sture Resi stance
Load Li fe
10
Ω
to 1M
Ω
range
<10
Ω
,>1M
Ω
±300 ppm ±100ppm ±50ppm ±400ppm
(standard)
(opt.)
(opt.)
(standard)
0.5%
0.5%
0.5%
0.75%
0.5%
0.5%
0.5%
1.0%
0.25%
0.5%
0.5%
0.5%
0.25%
0.5%
0.5%
0.5%
1%
0.75%
1.5%
1.5%
PART NUMBER DESIGNATION:
MCT0805
RCD Type
Options:
S = single sided termination
(leave blank for wraparound termination)
Res. Value:
4 digit code if tol. is 0.1% to 1%
(R100=0.1Ω, 1R00=1Ω, 10R0=10Ω, 1000=100Ω,
1001=1KΩ, 1002=10K, 1003=100K, 1004=1MΩ)
3 digit code if
≥2%
(R10=0.1Ω, 1R0=1Ω, 100= 10Ω,
101=100Ω, 102=1KΩ, 103=10K, 104=100K,105=1MΩ)
Tolerance Code:
B=0.1%, C=0.25%, D=0.5%,
F=1%, G=2%, J=5%, K=10%, M=20%
Packaging:
B=bulk, T=tape&reel, W=waffle tray
Optional TC Characteristic:
50 = 50ppm, 101 =
100ppm, 201= 200ppm, etc. (leave blank if standard)
Termination Material:
Standard = W (lead-free100% Tin
with Nickel barrier). Optional = Q (Tin-Lead solder with Ni
barrier), P= untinned Palladium Silver, G=Gold
- 1001 - F T 101 W
DERATING
% OF RATED POWER
100
75
50
25
0
35
70
105
140 150
175
AMBIENT TEMPERATURE (°C)
RCD Components Inc,
520 E.Industrial Park Dr, Manchester, NH, USA 03109
rcdcomponents.com
Tel: 603
-
669
-
0054 Fax: 603
-
669
-
5455 Email:sales@rcdcomponents.com
FA045B
Sale of this product is in accordance with GF-061. Specifications subject to change without notice.
17
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
