HCIS070-01GG datasheet, PDF - EEWORLD Datasheet

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HCIS070-01GG: DescriptionIC Socket, PGA70, 70 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,; CategoryThe connector socket; File Size146KB，2 Pages; ManufacturerAdvanced Interconnections Corp.

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HCIS070-01GG Overview

IC Socket, PGA70, 70 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

HCIS070-01GG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	1.0 OZ. AVG. INSERTION FORCE
body width	1.1 inch
subject depth	0.165 inch
body length	1.1 inch
Contact structure	11X11
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	PGA70
Shell material	GLASS FILLED THERMOPLASTIC
JESD-609 code	e4
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	70
Maximum operating temperature	260 °C
Minimum operating temperature	-60 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER
Base Number Matches	1

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Low Insertion Force

PGA Sockets

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Molded & FR-4 Low Insertion Force PGA Sockets

.100

(2.54)

.062

(1.57)

Molded

PC Board

FR-4

PC Board

Features:

• As low as 1 oz.(28.34 g) average insertion

force per pin.

• Multiple finger contacts for reliability.

• Over 500 PGA footprints available.

• Closed bottom terminal for 100% anti-

wicking of solder.

• Tapered entry for ease of insertion.

• To fit .100” (2.54 mm) grid.

• Easily customized to fit your application.

How To Order

1 oz. (28.34 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CIS - Standard Molded

HCIS - High Temp. Molded

FIS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

CIS

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Terminal Type

See next page

for terminal types

Terminals and Contacts:

Terminal: Brass - Copper Alloy (C36000)

ASTM-B-16

Contact: Beryllium Copper (C17200)

ASTM-B-194

How To Order

2.5 oz. (70.85 g) Average Insertion Force Sockets

Footprint Dash #

If Applicable*

Body Type

CS - Standard Molded

HCS - High Temp. Molded

FS - FR-4

Number of Pins

004 to 484

*See pages 37 - 64

for PGA footprints

Solder Preform:

63% Tin, 37% Lead

068

-01

Contact Plating

G - Gold

T - Tin-Lead

Terminal Plating

G - Gold

T - Tin-Lead

Plating:

Terminal: Gold over Nickel or

Tin-Lead over Nickel

Contact: Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Terminal Type

See next page

for terminal types

Sealant Options

RTV

Seal

Body Material:

CS/CIS -

Glass Filled Thermoplastic

Polyester (P.B.T.), U.L. Rated 94V-O,

-60˚C to 140˚C (-76˚F to 284˚F)

HCS/HCIS -

High Temp. Glass Filled

Thermoplastic (P.P.S.) , U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

FS/FIS -

FR-4 Fiberglass Epoxy Board,

U.L. Rated 94V-O, Index 140˚C (284˚F)

RTV Sealed

To order: Add RTV to end of part #

Note: RTV not available with HCS or HCIS Insulators

Tape Sealed

To order: Add 3M to end of part #

Page 32

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

inch/(mm)

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