CCM04 MK III Miniature Connectors
Introducing a new range of CCM04
connectors designed to interface with
either full or SIM/SAM smart cards and
designed to minimize space usage on
the PCB while maximizing price
economy.
Features
• Available with 6 or 8 contacts.
• By using an inlay finish in the contact
area, the life of the precious metal is
extended by up to 10 times that of a
standard gold plating.
• The contact area is spooned to reduce
the risk of accidental (or deliberate)
damage and to optimize the electrical
connection with the card.
• The insulators, molded from high
temperature thermoplastic, are suited
for infrared and convection soldering
processes.
• With tape and reel packaging as
standard, the connectors are designed
to be automatically pick and placed.
• Gold plating versions are also available.
Construction
Insulator
Contacts
Contact finish
PC Tail plating
Mechanical data
Mechanical life
Precious metal
Contact force
Contact travel
Electrical data
Insulation resistance
Contact resistance max
Switching current
Dielectric strength
Environmental data
Operating temperature
Soldering temperature
Salt mist
Damp heat
High temperature thermoplastic UL 94V.0
Copper Alloy
Gold Alloy Inlay (Au / Ag / Pd)
Tin lead (2 µm min) Sn / Pb
50,000 cycles minimum
5000 cycles minimum (see note 1)
0.25N min / 0.5N max
0.75mm
1000 MΩ min
100 mΩ max
10 µA min / 1 A max
500 Vrms min
-40°C to +85°C
Temperature/time profile acc. to CECC00802
para. 6.1, Fig. 3 with peak temperature
IEC 512 test number 11f (96 hours)
IEC 512 test number 11c (10 days)
Dimensions are shown in mm
Dimensions subject to change
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Embedded System
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