FPC Connectors
FP-03L
Series
0.3mm Pitch (SMT)
●
CFP76
-0250F
No. of Pins
A+3.5=D
A+2.6=C
0.12
0.5
4.8
1.4
(2.55)
Vacuum area
2.5
0.7
1.7
0.75
■
Features
1. Lower contact design.
2. A temporary FPC holding mechanism is provided
for better productivity.
3. With the insertion orifice designed as a box
structure, a one-touch sliding operation is
sufficient for positive locking.
4. Rigidity of a height level, and stable contact
when FPC is bent longitudinally are available.
5. Low profile of 1.9mm height when mounted.
6. Using the ZIF structure.
7. Supplied in the embossed taping with automatic
mounter.
1.9
(n-1)X0.3=A
0.6
0.3
1.1
3.95
A+0.65=B
0.55
0.55
5.3
No. of Pins
65
69
A
19.2
20.4
B
19.85
21.05
C
21.8
23.0
D
22.7
23.9
E
19.8
21.0
F
18.6
19.8
■
Specification
1. Rating : 0.3A, 50V AC/DC
2. Contact Resistance : 30mΩ, max., initially
3. InsuIation Resistance : 100MΩ, min., at 100V DC
4. Withstanding Roltage : 100V AC (for one minute)
5. Operating Temperature Range : –40˚C to +85˚C
■
P.C.
Board Dimension
Housing : Thermoplastic Resin,
Natural Color, 94V-0
●
Cover : Thermoplastic Resin,
Natural Color, 94V-0
●
Contact : Cu Alloy, Au Plating
●
0.3
±0.03
0.6
±0.03
A
±0.03
3.5
– 0.1
5.8
+0.1
0
■
Material and Plating
0
0.3
±0.03
■
Applicable
FPC Dimension
(t=0.2±0.03)
A+0.6=E
±0.05
A
±0.03
+0.04
0.6
±0.02
0.3
– 0.03
(0.1)
0.15
1.25
±0.15
1.15
±0.15
0.3
±0.15
0.2
(0.1)
2
Supported
board 4.5
3.3
±0.2
2.8
0.05
0.2
0.3
– 0.03
0.6
±0.02
+0.04
0.1
(0.1)
0.2
A-0.6=F
±0.03
0.6
±0.07
●
FPC plating to recommend : Au plating
8
0.5
2-
R0
0.3
±0.07
.2
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