DM54LS133W/883 datasheet, PDF - EEWORLD Datasheet

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DM54LS133W/883: DescriptionIC,LOGIC GATE,13-INPUT NAND,LS-TTL,FP,16PIN,CERAMIC; Categorylogic logic; File Size278KB，6 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM54LS133W/883 Overview

IC,LOGIC GATE,13-INPUT NAND,LS-TTL,FP,16PIN,CERAMIC

DM54LS133W/883 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.004 A
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Maximum supply current (ICC)	1.1 mA
Prop。Delay @ Nom-Sup	38 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

DM54LS133W/883 Related Products

	DM54LS133W/883	DM54LS133J/883	DM54LS133E/883	54LS133DM
Description	IC,LOGIC GATE,13-INPUT NAND,LS-TTL,FP,16PIN,CERAMIC	IC,LOGIC GATE,13-INPUT NAND,LS-TTL,DIP,16PIN,CERAMIC	IC,LOGIC GATE,13-INPUT NAND,LS-TTL,LLCC,20PIN,CERAMIC	IC,LOGIC GATE,13-INPUT NAND,LS-TTL,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	DIP, DIP16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknow
JESD-30 code	R-XDFP-F16	R-XDIP-T16	S-XQCC-N20	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A
Number of terminals	16	16	20	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	QCCN	DIP
Encapsulate equivalent code	FL16,.3	DIP16,.3	LCC20,.35SQ	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	1.1 mA	1.1 mA	1.1 mA	1.1 mA
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL
Prop。Delay @ Nom-Sup	38 ns	38 ns	38 ns	-
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-

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