DM54AS34J/883C datasheet, PDF - EEWORLD Datasheet

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DM54AS34J/883C: DescriptionIC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,CERAMIC; Categorylogic logic; File Size95KB，2 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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DM54AS34J/883C Overview

IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,CERAMIC

DM54AS34J/883C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	compliant
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.02 A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum supply current (ICC)	34.6 mA
Prop。Delay @ Nom-Sup	7 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883 Class C
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

DM54AS34J/883C Related Products

	DM54AS34J/883C	DM74AS34N/B+	DM74AS34N/A+	DM74AS34J	DM74AS34J/A+
Description	IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,CERAMIC	IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,PLASTIC	IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,PLASTIC	IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,CERAMIC	IC,LOGIC GATE,HEX BUFFER,AS-TTL,DIP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	compliant	unknown	unknown	compliant	unknown
JESD-30 code	R-XDIP-T14	R-PDIP-T14	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Number of terminals	14	14	14	14	14
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	34.6 mA	34.6 mA	34.6 mA	34.6 mA	34.6 mA
Prop。Delay @ Nom-Sup	7 ns	6 ns	6 ns	6 ns	6 ns
Schmitt trigger	NO	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
package instruction	DIP, DIP14,.3	-	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Certification status	Not Qualified	Not Qualified	-	Not Qualified	-
Base Number Matches	1	1	1	1	-
Maker	-	National Semiconductor（TI ）	National Semiconductor（TI ）	-	National Semiconductor（TI ）

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