IC,ROM,256X4,TTL,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F16 |
| JESD-609 code | e0 |
| memory density | 1024 bit |
| Memory IC Type | MASK ROM |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 256 words |
| character code | 256 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 256X4 |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum slew rate | 0.025 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
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