IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| DS8885J/A+ | DS8885J | DS8885N | DS8885N/A+ | DS8885N/B+ | |
|---|---|---|---|---|---|
| Description | IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,CERAMIC | IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,CERAMIC | IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,PLASTIC | IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,PLASTIC | IC,DISPLAY DRIVER, OTHER/SPECIAL/MISCELLANEOUS,BIPOLAR,DIP,16PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Certification status | - | Not Qualified | Not Qualified | - | Not Qualified |
京公网安备 11010802033920号
EEWORLD
