OTP ROM, 512X8, 90ns, TTL, CDIP24,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | compliant |
| Maximum access time | 90 ns |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512X8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MD3624A | D3624 | MD3624A/B | 5962-01-102-3846 | |
|---|---|---|---|---|
| Description | OTP ROM, 512X8, 90ns, TTL, CDIP24, | OTP ROM, 512X8, 70ns, TTL, CDIP24, | OTP ROM, 512X8, 90ns, TTL, CDIP24, | OTP ROM, 512X8, 70ns, TTL, CDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | compliant | unknown | compliant | compli |
| Maximum access time | 90 ns | 70 ns | 90 ns | 70 ns |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bi |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 24 | 24 | 24 |
| word count | 512 words | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 | 512 |
| Maximum operating temperature | 125 °C | 70 °C | 125 °C | 70 °C |
| organize | 512X8 | 512X8 | 512X8 | 512X8 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| JESD-609 code | e0 | e0 | e0 | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Base Number Matches | 1 | 1 | 1 | - |