OTP ROM, 1KX4, 60ns, TTL, CDIP18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| Maximum access time | 60 ns |
| JESD-30 code | R-XDIP-T18 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | OTP ROM |
| memory width | 4 |
| Number of terminals | 18 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX4 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MD3625A | MD3625A/B | MD3625A/C | |
|---|---|---|---|
| Description | OTP ROM, 1KX4, 60ns, TTL, CDIP18 | OTP ROM, 1KX4, 60ns, TTL, CDIP18 | OTP ROM, 1KX4, 60ns, TTL, CDIP18 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Maximum access time | 60 ns | 60 ns | 60 ns |
| JESD-30 code | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM |
| memory width | 4 | 4 | 4 |
| Number of terminals | 18 | 18 | 18 |
| word count | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 1KX4 | 1KX4 | 1KX4 |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| Filter level | - | 38535Q/M;38534H;883B | MIL-STD-883 Class C |